Abstract
In this paper, the electric field is analyzed in a three-dimensional, inhomogeneously-filled stripline structure. The spectral domain technique is first used to obtain the field expressions in the spectral domain. Analytically performing the two-dimensional inverse Fourier transform results in electric fields that are expressed as closed-form solutions in terms of special functions that are free from any numerical integration. The closed-form solutions permit efficient, accurate full-wave simulations for packaging structures. Computational results for the fields are presented and the physical phenomenology of the fields is studied.
| Original language | English (US) |
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| Pages | 157-160 |
| Number of pages | 4 |
| State | Published - 2001 |
| Event | IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging - Cambridge, MA, United States Duration: Oct 29 2001 → Oct 31 2001 |
Other
| Other | IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging |
|---|---|
| Country/Territory | United States |
| City | Cambridge, MA |
| Period | 10/29/01 → 10/31/01 |
ASJC Scopus subject areas
- Engineering(all)