Fabrication of microchannels with patterned bio-active layers

Ryo Iwama, Lap Man Lee, Eung San Cho, Yitshak Zohar

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations


Patterns of bio-active coatings on the inner surfaces of microchannels have been realized using a novel low-temperature, UV-epoxy glass-to-silicon bonding technique. Sucrose is applied as a protection layer for the immobilized bio-functional films during the bonding step. The bio-functional layer is composed of antibody patterns, for binding specific targets, next to polyethylene glycol (PEG) coated regions for preventing non-specific absorption. The activity of the patterned bio layer is tested, after the removal of the sucrose protection layer, utilizing fluorescent microscopy. A solution of fluorescent-labelled antigens is injected into the microchannels for incubation with the immobilized antibodies. Upon exposure to proper radiation, light is emitted only from the antibody patterns while the PEG regions remain dark. Hence, the sucrose-protection and UV-bonding techniques have not significantly compromised the functionality of the patterned antibodies, in binding to their counter receptors, and PEG molecules, in preventing non-specific adsorption, at the end of the fabrication process.

Original languageEnglish (US)
Title of host publicationProceedings - CIS Workshops 2007, 2007 International Conference on Computational Intelligence and Security Workshops, CISW 2007
Number of pages4
StatePublished - 2007
Event20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007 - Kobe, Japan
Duration: Jan 21 2007Jan 25 2007

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999


Other20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering


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