Fabrication Issues for Free-space Optics at the Board Packaging Level

R. K. Kostuk

doi:10.1109/LEOSST.1993.696871

Fabrication Issues for Free-space Optics at the Board Packaging Level

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English (US)
Title of host publication	Leos 1993 Summer Topical Meeting Digest on Optical Microwave Interactions/Visible Semiconductor Lasers/Impact of Fiber Nonlinearities on Lightwave Systems/Hybrid Optoelectronic Integration and Packaging/Gigabit Networks, LEOSST 1993
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	19-20
Number of pages	2
ISBN (Electronic)	0780312848, 9780780312845
DOIs	https://doi.org/10.1109/LEOSST.1993.696871
State	Published - 1994
Externally published	Yes
Event	Leos 1993 Summer Topical Meeting Digest on Optical Microwave Interactions/Visible Semiconductor Lasers/Impact of Fiber Nonlinearities on Lightwave Systems/Hybrid Optoelectronic Integration and Packaging/Gigabit Networks, LEOSST 1993 - Santa Barbara, United States Duration: Jul 19 1993 → Jul 21 1993

Publication series

Name	Leos 1993 Summer Topical Meeting Digest on Optical Microwave Interactions/Visible Semiconductor Lasers/Impact of Fiber Nonlinearities on Lightwave Systems/Hybrid Optoelectronic Integration and Packaging/Gigabit Networks, LEOSST 1993

Conference

Conference	Leos 1993 Summer Topical Meeting Digest on Optical Microwave Interactions/Visible Semiconductor Lasers/Impact of Fiber Nonlinearities on Lightwave Systems/Hybrid Optoelectronic Integration and Packaging/Gigabit Networks, LEOSST 1993
Country/Territory	United States
City	Santa Barbara
Period	7/19/93 → 7/21/93

ASJC Scopus subject areas

Computer Networks and Communications
Signal Processing
Instrumentation
Atomic and Molecular Physics, and Optics

Access to Document

10.1109/LEOSST.1993.696871

Cite this

Kostuk, R. K. (1994). Fabrication Issues for Free-space Optics at the Board Packaging Level. In Leos 1993 Summer Topical Meeting Digest on Optical Microwave Interactions/Visible Semiconductor Lasers/Impact of Fiber Nonlinearities on Lightwave Systems/Hybrid Optoelectronic Integration and Packaging/Gigabit Networks, LEOSST 1993 (pp. 19-20). Article 696871 (Leos 1993 Summer Topical Meeting Digest on Optical Microwave Interactions/Visible Semiconductor Lasers/Impact of Fiber Nonlinearities on Lightwave Systems/Hybrid Optoelectronic Integration and Packaging/Gigabit Networks, LEOSST 1993). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/LEOSST.1993.696871

Fabrication Issues for Free-space Optics at the Board Packaging Level. / Kostuk, R. K.
Leos 1993 Summer Topical Meeting Digest on Optical Microwave Interactions/Visible Semiconductor Lasers/Impact of Fiber Nonlinearities on Lightwave Systems/Hybrid Optoelectronic Integration and Packaging/Gigabit Networks, LEOSST 1993. Institute of Electrical and Electronics Engineers Inc., 1994. p. 19-20 696871 (Leos 1993 Summer Topical Meeting Digest on Optical Microwave Interactions/Visible Semiconductor Lasers/Impact of Fiber Nonlinearities on Lightwave Systems/Hybrid Optoelectronic Integration and Packaging/Gigabit Networks, LEOSST 1993).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kostuk, RK 1994, Fabrication Issues for Free-space Optics at the Board Packaging Level. in Leos 1993 Summer Topical Meeting Digest on Optical Microwave Interactions/Visible Semiconductor Lasers/Impact of Fiber Nonlinearities on Lightwave Systems/Hybrid Optoelectronic Integration and Packaging/Gigabit Networks, LEOSST 1993., 696871, Leos 1993 Summer Topical Meeting Digest on Optical Microwave Interactions/Visible Semiconductor Lasers/Impact of Fiber Nonlinearities on Lightwave Systems/Hybrid Optoelectronic Integration and Packaging/Gigabit Networks, LEOSST 1993, Institute of Electrical and Electronics Engineers Inc., pp. 19-20, Leos 1993 Summer Topical Meeting Digest on Optical Microwave Interactions/Visible Semiconductor Lasers/Impact of Fiber Nonlinearities on Lightwave Systems/Hybrid Optoelectronic Integration and Packaging/Gigabit Networks, LEOSST 1993, Santa Barbara, United States, 7/19/93. https://doi.org/10.1109/LEOSST.1993.696871

Kostuk RK. Fabrication Issues for Free-space Optics at the Board Packaging Level. In Leos 1993 Summer Topical Meeting Digest on Optical Microwave Interactions/Visible Semiconductor Lasers/Impact of Fiber Nonlinearities on Lightwave Systems/Hybrid Optoelectronic Integration and Packaging/Gigabit Networks, LEOSST 1993. Institute of Electrical and Electronics Engineers Inc. 1994. p. 19-20. 696871. (Leos 1993 Summer Topical Meeting Digest on Optical Microwave Interactions/Visible Semiconductor Lasers/Impact of Fiber Nonlinearities on Lightwave Systems/Hybrid Optoelectronic Integration and Packaging/Gigabit Networks, LEOSST 1993). doi: 10.1109/LEOSST.1993.696871

Kostuk, R. K. / Fabrication Issues for Free-space Optics at the Board Packaging Level. Leos 1993 Summer Topical Meeting Digest on Optical Microwave Interactions/Visible Semiconductor Lasers/Impact of Fiber Nonlinearities on Lightwave Systems/Hybrid Optoelectronic Integration and Packaging/Gigabit Networks, LEOSST 1993. Institute of Electrical and Electronics Engineers Inc., 1994. pp. 19-20 (Leos 1993 Summer Topical Meeting Digest on Optical Microwave Interactions/Visible Semiconductor Lasers/Impact of Fiber Nonlinearities on Lightwave Systems/Hybrid Optoelectronic Integration and Packaging/Gigabit Networks, LEOSST 1993).

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Fabrication Issues for Free-space Optics at the Board Packaging Level

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