Fabrication and characterization of an integrated thermal microsystem

Keyphrases

• Microsystems 100%
• Two-phase Flow 100%
• Fluid Flow 50%
• Liquid Phase 50%
• Flow Pattern 50%
• Wafer 50%
• Input Power Level 50%
• Temperature Distribution 50%
• Good Control 50%
• Phase Flow 50%
• Pressure Measurement 50%
• Boiling Curve 50%
• Pressure Signal 50%
• Time Pressure 50%
• Pressure Sensor 50%
• Temperature Sensor 50%
• Convective Boiling 50%
• Pressure Fluctuation 50%
• Micro-temperature Sensor 50%
• Quantitative Temperature Measurement 50%
• Thermal Boundary Conditions 50%
• Etch Back 50%
• Uniform Heat Flux Boundary Conditions 50%
• Critical Heat Flux 50%
• Heat Pressure 50%
• Heat Source Temperature 50%

Engineering

• Microsystem 100%
• Two-Phase Flow 100%
• Fluid Flow 50%
• Power Level 50%
• Liquid Phase 50%
• Boundary Condition 50%
• Input Power 50%
• Boiling Curve 50%
• Temperature Distribution 50%
• Heat Source 50%
• Pressure Signal 50%
• Microsensor 50%
• Convective Boiling 50%
• Pressure Fluctuation 50%
• Pressure Sensor 50%
• Thermal Boundary Condition 50%
• Critical Heat Flux 50%
• Uniform Heat Flux 50%
• Phase Flow 50%

Chemical Engineering

• Heat Flux 100%
• Pressure Measurement 50%
• Temperature Distribution 50%
• Fluid Flow 50%