TY - JOUR
T1 - Extension of an efficient moment-methods-based full-wave layered interconnect simulator to finite-width expansion functions
AU - Zhu, Zhaohui
AU - Li, Qiang
AU - Wang, Xing
AU - Dvorak, Steven L.
AU - Prince, John L.
N1 - Funding Information:
Manuscript received December 27, 2004; revised April 1, 2007. This work was supported in part by the National Science Foundation’s Center for Low-Power Electronics (CLPE) under Grant EEC-9523338 and in part by the Semiconductor Research Corporation (SRC) under Contract 2001.NJ.956.001. Z. Zhu is with Intel Corporation, Chandler, AZ 85226 USA (e-mail: zhaohui. [email protected]). Q. Li is with Freescale Semiconductor Inc, Tempe, AZ 85284 USA (e-mail: [email protected]). X. Wang is with NVIDIA Corporation, Santa Clara, CA 95050 USA (e-mail: [email protected]). S. L. Dvorak is with the Department of Electrical and Computer Engineering, The University of Arizona, Tucson, AZ 85721 USA (e-mail: dvorak@ece. arizona.edu). J. L. Prince, deceased, was with the Department of Electrical and Computer Engineering, The University of Arizona, Tucson, AZ 85721 USA. Color versions of one or more of the figures in this paper are available online at http://ieeexplore.ieee.org. Digital Object Identifier 10.1109/TADVP.2007.906386
PY - 2007/11
Y1 - 2007/11
N2 - A computationally efficient full-wave tool, which can correctly model the high frequency effects in advanced 3-D packaging designs, e.g., crosstalk, signal distortion, etc., is highly desirable for the design iteration process. A prototype full-wave layered interconnect simulator, which employs a filamentary approximation, was previously developed to model stripline circuits. It demonstrated the promise of new analytical techniques used to accelerate the method-of-moments-based full-wave simulator. Recently, a series of extensions has been made to enhance the prototype simulator. One key extension that is discussed in this paper is the incorporation of rectangular-based finite-width expansion functions into the simulator, which allows the simulator to handle more practical cases. Furthermore, this extension provides the technical foundation required to model bends, steps, and other interconnect features in the future. Some critical issues, which were not properly addressed in the prototype simulator, are also addressed in this paper. They are the branch point contribution to the reaction element and the exact solution for an angular canonical function. A computationally efficient expression for the computation of the semi-infinite integral is also included. This enhanced simulator is validated by comparing it with results produced by Agilent Momentum, and great improvements in matrix fill times are demonstrated.
AB - A computationally efficient full-wave tool, which can correctly model the high frequency effects in advanced 3-D packaging designs, e.g., crosstalk, signal distortion, etc., is highly desirable for the design iteration process. A prototype full-wave layered interconnect simulator, which employs a filamentary approximation, was previously developed to model stripline circuits. It demonstrated the promise of new analytical techniques used to accelerate the method-of-moments-based full-wave simulator. Recently, a series of extensions has been made to enhance the prototype simulator. One key extension that is discussed in this paper is the incorporation of rectangular-based finite-width expansion functions into the simulator, which allows the simulator to handle more practical cases. Furthermore, this extension provides the technical foundation required to model bends, steps, and other interconnect features in the future. Some critical issues, which were not properly addressed in the prototype simulator, are also addressed in this paper. They are the branch point contribution to the reaction element and the exact solution for an angular canonical function. A computationally efficient expression for the computation of the semi-infinite integral is also included. This enhanced simulator is validated by comparing it with results produced by Agilent Momentum, and great improvements in matrix fill times are demonstrated.
KW - Full wave
KW - Interconnect
KW - Moment method
KW - Simulation software
KW - Stripline
UR - http://www.scopus.com/inward/record.url?scp=36349034061&partnerID=8YFLogxK
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U2 - 10.1109/TADVP.2007.906386
DO - 10.1109/TADVP.2007.906386
M3 - Article
AN - SCOPUS:36349034061
SN - 1521-3323
VL - 30
SP - 841
EP - 850
JO - IEEE Transactions on Advanced Packaging
JF - IEEE Transactions on Advanced Packaging
IS - 4
ER -