Exposure to fungi liberated from paper-clay in a pottery fabrication studio

John T. Gyger, Mary Kay O'Rourke, Mark Van Ert

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We observed fungal colonies on unused paper-clay bricks in a sculptural studio and had concern for mold exposure among the artists. Using two methods (Aerotech 6™ and Zeflon cassettes) we evaluated fungal concentrations inside and outside the facility prior to, during and following clay handling. Fourteen taxa of fungal colonies and spores were identified microscopically (400-1000X). The indoor/outdoor ratio prior to fabrication activities was 1.50 for viable fungi and 0.99 for total spores. The indoor ratios (pre-activity to activity) were 11.60 for viable fungi and 11.02 for total spore counts. During fabrication viable fungal concentrations by species were: Aspergillus (7-493 CFU/m3), Cladosporium (7 51 CFU/m3), Mucoraceae (14-813 CFU/m3) and Penicillium (7-813 CFU/m3) while total spore concentrations were: Cladosporium (13- 213 spores/m3), smut (40-533 spores/m3), and the combination of Penicillium/Aspergillus spores (13 - 1240 spores/m3).

Original languageEnglish (US)
Title of host publication12th International Conference on Indoor Air Quality and Climate 2011
Pages2640-2645
Number of pages6
StatePublished - 2011
Event12th International Conference on Indoor Air Quality and Climate 2011 - Austin, TX, United States
Duration: Jun 5 2011Jun 10 2011

Publication series

Name12th International Conference on Indoor Air Quality and Climate 2011
Volume4

Other

Other12th International Conference on Indoor Air Quality and Climate 2011
Country/TerritoryUnited States
CityAustin, TX
Period6/5/116/10/11

Keywords

  • Artist studio
  • Bioaerosols
  • Fabrication process
  • Fungi
  • Paper-clay

ASJC Scopus subject areas

  • Pollution

Fingerprint

Dive into the research topics of 'Exposure to fungi liberated from paper-clay in a pottery fabrication studio'. Together they form a unique fingerprint.

Cite this