Abstract
The poor lateral and depth resolution of state-of-The-Art 3D sensors based on the time-of-flight (ToF) principle has limited widespread adoption to a few niche applications. In this work, we introduce a novel sensor concept that provides ToF-based 3D measurements of real world objects and surfaces with depth precision up to 35\mu mμm and point cloud densities commensurate with the native sensor resolution of standard CMOS/CCD detectors (up to several megapixels). Such capabilities are realized by combining the best attributes of continuous wave ToF sensing, multi-wavelength interferometry, and heterodyne interferometry into a single approach. We describe multiple embodiments of the approach, each featuring a different sensing modality and associated tradeoffs.
| Original language | English (US) |
|---|---|
| Article number | 9411705 |
| Pages (from-to) | 2193-2205 |
| Number of pages | 13 |
| Journal | IEEE Transactions on Pattern Analysis and Machine Intelligence |
| Volume | 43 |
| Issue number | 7 |
| DOIs | |
| State | Published - Jul 1 2021 |
| Externally published | Yes |
Keywords
- computational photography
- optical interferometry
- Three-dimensional imaging
ASJC Scopus subject areas
- Software
- Computer Vision and Pattern Recognition
- Computational Theory and Mathematics
- Applied Mathematics
- Artificial Intelligence
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