Abstract
Hotspots imposed by spatially non-uniform heal flux in a high performance circuit increase the chip maximum junction temperature, which degrades the reliability and performance of electronic equipments. Microchannel heat sinks with two-phase convective heat transfer are effective for removing high heat flux exceeding 100 W/cm2. Cross-linking of microchannels can be promising for achieving better temperature uniformity and more effective cooling due to the lateral fluid transport and mixing. This study experimentally investigates the impact of mass flow distribution on the chip temperature field in a multi-channel heat sink. Further more, the performance of two microchannel heat sinks is compared with different configurations: a regular microchannel heat sink and a cross-linked microchannel heat sink.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 242-246 |
| Number of pages | 5 |
| Journal | Annual IEEE Semiconductor Thermal Measurement and Management Symposium |
| State | Published - 2003 |
| Externally published | Yes |
| Event | Nineteents Annual IEEE Semiconductor Thermal Measurement And Management Symposium - San Jose, CA, United States Duration: Mar 11 2003 → Mar 13 2003 |
Keywords
- Cross-linked microchannel heat sink
- Hotspot
- Two-phase heat transfer
ASJC Scopus subject areas
- Instrumentation
- Electrical and Electronic Engineering