Experimental investigation and numerical simulation of pad stain formation during copper CMP

Lee Hyosang, Zhuang Yun, Leonard Borucki, Fergal O'Moore, Joh Sooyun, Ara Philipossian

Research output: Chapter in Book/Report/Conference proceedingConference contribution


Experiments and simulations were performed to investigate the characteristics of staining on pad surface. Experiments were performed on a table-top axisymmetric polishing system, consisting of a 12-inch non-rotating platen and a 4-inch rotating wafer carrier. Stain deposited on each land area was found to be darker in the direction of wafer rotation and in the radial direction, suggesting that the staining agent was produced by mechanical action during polishing and subsequently was advected downstream by slurry flow. While staining increased with polishing pressure, wafer rotation rate and polishing time, it did not seem to affect removal rate. Slurry velocity simulations showed shear flow on the land areas and wafer-driven circulation in the grooves. Temperature simulations showed a 12 °C rise in the reaction temperature on the surface of the copper wafer. Simulated stain images were in qualitative agreement with experimental results.

Original languageEnglish (US)
Title of host publication2007 MRS Spring Meeting
Number of pages6
StatePublished - 2007
Event2007 MRS Spring Meeting - San Francisco, CA, United States
Duration: Apr 9 2007Apr 13 2007

Publication series

NameMaterials Research Society Symposium Proceedings
ISSN (Print)0272-9172


Other2007 MRS Spring Meeting
Country/TerritoryUnited States
CitySan Francisco, CA

ASJC Scopus subject areas

  • General Materials Science
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


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