Experimental and numerical analysis of an inhibitor-containing slurry for copper chemical mechanical planarization

Yun Zhuang, Zhonglin Li, Yoshitomo Shimazu, Nobuo Uotani, Leonard Borucki, Ara Philipossian

Research output: Contribution to journalArticlepeer-review

9 Scopus citations


A slurry containing Benzotriazole (BTA) as the inhibitor was analyzed in terms of its frictional, thermal and kinetic attributes for copper CMP applications. The frictional analysis indicated that 'boundary lubrication' was the dominant tribological mechanism. Due to the presence of the inhibitor in the slurry, copper removal rate exhibited a highly non-Prestonian behavior. Based on the measured coefficient of friction (COF) and pad temperature data, a proven thermal model was used to predict wafer temperature. The Preston Equation was used to describe the polishing rate when p × V was lower than 11,000 Pa·m/s; while a modified Langmuir-Hinshelwood kinetic model was used to simulate the copper removal when p × V was higher than 11,555 Pa·m/s. Assuming that the adsorbed inhibitor layer was abraded off instantly from the copper surface when p × V was higher than 11,555 Pa·m/s, the modified Langmuir-Hinshelwood kinetic model indicated that copper polishing was chemically limited in this polishing region.

Original languageEnglish (US)
Pages (from-to)82-86
Number of pages5
JournalJapanese Journal of Applied Physics, Part 2: Letters
Issue number1 A
StatePublished - Jan 2005
Externally publishedYes


  • BTA inhibitor
  • Coefficient of friction
  • Copper CMP
  • Modified Langmuir-Hinshelwood model
  • Pad and wafer temperatures
  • Preston Equation

ASJC Scopus subject areas

  • General Engineering
  • General Physics and Astronomy


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