Evaluation of copper oxide to copper selectivity of chemical systems for BEOL cleaning through electrochemical investigations

Nandini Venkataraman, Ashok Kumar Muthukumaran, Srini Raghavan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Scopus citations


Back End of Line (BEOL) cleaning of copper based structures requires chemical formulations that can remove copper oxide selectively without corroding copper and etching the dielectric. Many commercially available semi-aqueous and all aqueous formulations claim to meet these criteria. These include semi-aqueous fluoride strippers (SAF) and all- aqueous ammonium phosphate based chemical systems. This paper will report the results from a fundamental study undertaken to evaluate the performance of a semi-aqueous fluoride formulation in removing copper oxide films of controlled thickness grown on copper. The thickness and composition of the oxide films were determined electrochemically using cathodic reduction technique. Electrochemical Impedance spectra of samples immersed in the formulation have been measured as a function of time to follow copper oxide dissolution and the data have been analyzed to detect the transition of copper oxide to copper.

Original languageEnglish (US)
Title of host publicationMaterials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics
PublisherMaterials Research Society
Number of pages6
ISBN (Print)9781558999503
StatePublished - 2007
Event2007 MRS Spring Meeting - San Francisco, CA, United States
Duration: Apr 9 2007Apr 13 2007

Publication series

NameMaterials Research Society Symposium Proceedings
ISSN (Print)0272-9172


Other2007 MRS Spring Meeting
Country/TerritoryUnited States
CitySan Francisco, CA


  • BEOL cleaning
  • Copper oxide removal
  • Electrochemical impedance spectroscopy

ASJC Scopus subject areas

  • General Materials Science
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


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