The etch rate of sputter coated silicon and thermally grown silica in ammonia-peroxide and ammonia solutions has been investigated using a quartz crystal microbalance (QCM) technique. The results obtained have been compared with literature results using more conventional techniques to show that a QCM is a valuable in situ measurement technique to follow very small etch rates.
ASJC Scopus subject areas
- Chemical Engineering(all)
- Materials Science(all)
- Physical and Theoretical Chemistry
- Electrical and Electronic Engineering