Equivalent acceleration assessment of JEDEC moisture sensitivity levels using peridynamics

Sungwon Han; Seyoung Lim; Jangyoung Bae; Yuchul Hwang; Sungsoo Lee; Selda Oterkus; Erdogan Madenci; Cagan Diyaroglu; Erkan Oterkus

doi:10.1109/ECTC.2015.7159799

Equivalent acceleration assessment of JEDEC moisture sensitivity levels using peridynamics

Sungwon Han, Seyoung Lim, Jangyoung Bae, Yuchul Hwang, Sungsoo Lee, Selda Oterkus, Erdogan Madenci, Cagan Diyaroglu, Erkan Oterkus

Aerospace and Mechanical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

7 Scopus citations

Abstract

The moisture inside the IC packages induces the several deformation failures, such as popcorn crack and swelling during the solder reflowing process. In semiconductor industry, over the past few years, the equivalent acceleration time for JEDEC moisture sensitivity level has been updated based on the weight gain measurements when the package structure and materials were modified. It costs long test times which may induce the significant delay of new product development and reliability evaluation. Additionally, the weight gain equivalency may not be sufficient to determine the equivalent accelerated time. In this paper, the new approach for evaluating the equivalent acceleration test time for preconditioning is proposed using the numerical calculation by peridynamics (PD) theory. The essential of proposed method is analyzing a moisture concentration and a vapor pressure which can cause the moisture induced failure in IC packages without facing the discontinuity problems of moisture concentration along the interfaces.

Original language	English (US)
Title of host publication	2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1518-1523
Number of pages	6
ISBN (Electronic)	9781479986095
DOIs	https://doi.org/10.1109/ECTC.2015.7159799
State	Published - Jul 15 2015
Event	2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015 - San Diego, United States Duration: May 26 2015 → May 29 2015

Publication series

Name	Proceedings - Electronic Components and Technology Conference
Volume	2015-July
ISSN (Print)	0569-5503

Other

Other	2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015
Country/Territory	United States
City	San Diego
Period	5/26/15 → 5/29/15

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/ECTC.2015.7159799

Cite this

Han, S., Lim, S., Bae, J., Hwang, Y., Lee, S., Oterkus, S., Madenci, E., Diyaroglu, C., & Oterkus, E. (2015). Equivalent acceleration assessment of JEDEC moisture sensitivity levels using peridynamics. In 2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015 (pp. 1518-1523). Article 7159799 (Proceedings - Electronic Components and Technology Conference; Vol. 2015-July). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2015.7159799

Equivalent acceleration assessment of JEDEC moisture sensitivity levels using peridynamics. / Han, Sungwon; Lim, Seyoung; Bae, Jangyoung et al.
2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015. Institute of Electrical and Electronics Engineers Inc., 2015. p. 1518-1523 7159799 (Proceedings - Electronic Components and Technology Conference; Vol. 2015-July).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Han, S, Lim, S, Bae, J, Hwang, Y, Lee, S, Oterkus, S, Madenci, E, Diyaroglu, C & Oterkus, E 2015, Equivalent acceleration assessment of JEDEC moisture sensitivity levels using peridynamics. in 2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015., 7159799, Proceedings - Electronic Components and Technology Conference, vol. 2015-July, Institute of Electrical and Electronics Engineers Inc., pp. 1518-1523, 2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015, San Diego, United States, 5/26/15. https://doi.org/10.1109/ECTC.2015.7159799

Han S, Lim S, Bae J, Hwang Y, Lee S, Oterkus S et al. Equivalent acceleration assessment of JEDEC moisture sensitivity levels using peridynamics. In 2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015. Institute of Electrical and Electronics Engineers Inc. 2015. p. 1518-1523. 7159799. (Proceedings - Electronic Components and Technology Conference). doi: 10.1109/ECTC.2015.7159799

@inproceedings{1836560c13dc4ff79ad13217f49baf7a,

title = "Equivalent acceleration assessment of JEDEC moisture sensitivity levels using peridynamics",

abstract = "The moisture inside the IC packages induces the several deformation failures, such as popcorn crack and swelling during the solder reflowing process. In semiconductor industry, over the past few years, the equivalent acceleration time for JEDEC moisture sensitivity level has been updated based on the weight gain measurements when the package structure and materials were modified. It costs long test times which may induce the significant delay of new product development and reliability evaluation. Additionally, the weight gain equivalency may not be sufficient to determine the equivalent accelerated time. In this paper, the new approach for evaluating the equivalent acceleration test time for preconditioning is proposed using the numerical calculation by peridynamics (PD) theory. The essential of proposed method is analyzing a moisture concentration and a vapor pressure which can cause the moisture induced failure in IC packages without facing the discontinuity problems of moisture concentration along the interfaces.",

author = "Sungwon Han and Seyoung Lim and Jangyoung Bae and Yuchul Hwang and Sungsoo Lee and Selda Oterkus and Erdogan Madenci and Cagan Diyaroglu and Erkan Oterkus",

note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; 2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015 ; Conference date: 26-05-2015 Through 29-05-2015",

year = "2015",

month = jul,

day = "15",

doi = "10.1109/ECTC.2015.7159799",

language = "English (US)",

series = "Proceedings - Electronic Components and Technology Conference",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "1518--1523",

booktitle = "2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015",

}

TY - GEN

T1 - Equivalent acceleration assessment of JEDEC moisture sensitivity levels using peridynamics

AU - Han, Sungwon

AU - Lim, Seyoung

AU - Bae, Jangyoung

AU - Hwang, Yuchul

AU - Lee, Sungsoo

AU - Oterkus, Selda

AU - Madenci, Erdogan

AU - Diyaroglu, Cagan

AU - Oterkus, Erkan

PY - 2015/7/15

Y1 - 2015/7/15

N2 - The moisture inside the IC packages induces the several deformation failures, such as popcorn crack and swelling during the solder reflowing process. In semiconductor industry, over the past few years, the equivalent acceleration time for JEDEC moisture sensitivity level has been updated based on the weight gain measurements when the package structure and materials were modified. It costs long test times which may induce the significant delay of new product development and reliability evaluation. Additionally, the weight gain equivalency may not be sufficient to determine the equivalent accelerated time. In this paper, the new approach for evaluating the equivalent acceleration test time for preconditioning is proposed using the numerical calculation by peridynamics (PD) theory. The essential of proposed method is analyzing a moisture concentration and a vapor pressure which can cause the moisture induced failure in IC packages without facing the discontinuity problems of moisture concentration along the interfaces.

AB - The moisture inside the IC packages induces the several deformation failures, such as popcorn crack and swelling during the solder reflowing process. In semiconductor industry, over the past few years, the equivalent acceleration time for JEDEC moisture sensitivity level has been updated based on the weight gain measurements when the package structure and materials were modified. It costs long test times which may induce the significant delay of new product development and reliability evaluation. Additionally, the weight gain equivalency may not be sufficient to determine the equivalent accelerated time. In this paper, the new approach for evaluating the equivalent acceleration test time for preconditioning is proposed using the numerical calculation by peridynamics (PD) theory. The essential of proposed method is analyzing a moisture concentration and a vapor pressure which can cause the moisture induced failure in IC packages without facing the discontinuity problems of moisture concentration along the interfaces.

UR - http://www.scopus.com/inward/record.url?scp=84942155151&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84942155151&partnerID=8YFLogxK

U2 - 10.1109/ECTC.2015.7159799

DO - 10.1109/ECTC.2015.7159799

M3 - Conference contribution

AN - SCOPUS:84942155151

T3 - Proceedings - Electronic Components and Technology Conference

SP - 1518

EP - 1523

BT - 2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015

Y2 - 26 May 2015 through 29 May 2015

ER -

Equivalent acceleration assessment of JEDEC moisture sensitivity levels using peridynamics

Abstract

Publication series

Other

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this