Electrical transport in corrugated multilayered structures

P. M. Levy, S. Zhang, T. Ono, T. Shinjo

Research output: Contribution to journalArticlepeer-review

44 Scopus citations


Recently corrugated multilayered structures of Cu/Co/Cu/NiFe have been grown on silicon substrates which have (111) faceted grooves etched on their surface. These structures can be probed by conventional means with current at an angle to the plane of layers (CAP) as well as for currents in the plane. The CAP magnetoresistance (MR) has been found to be up to 50% greater than that for currents in the plane of the layers (CIP). We have derived the relation between the resistivities for CIP, CAP, and CPP (currents perpendicular to the plane of layers), in terms of the angle between the current and planes of the layers. From the measurement of the CIP and CAP-MRs we predict the CPP-MR for these structures.

Original languageEnglish (US)
Pages (from-to)16049-16054
Number of pages6
JournalPhysical Review B
Issue number22
StatePublished - 1995

ASJC Scopus subject areas

  • Condensed Matter Physics


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