TY - GEN
T1 - Electrical performance evaluation for multi-chip assemblies using knowledge based approach
AU - Hsu, Pochang
AU - Senthinathan, R.
AU - Rozenblit, J. W.
AU - Prince, John L.
N1 - Publisher Copyright:
© 1992 IEEE.
PY - 1992
Y1 - 1992
N2 - In this paper, preliminary work on electrical performance estimation and evaluation for multi-chip assemblies (i.e., multi-chip modules, chip on board, and etc.) is presented. A knowledge base is built to facilitate system performance merits evaluation process. Even though many other parameters can be included in the performance merit set, at this stage only electrical performance merits such as module frequency, module size and power dissipation are modeled. The other performance merits (e.g., cost estimation, thermal resistance and reliability, and etc.) are to be included in future work.
AB - In this paper, preliminary work on electrical performance estimation and evaluation for multi-chip assemblies (i.e., multi-chip modules, chip on board, and etc.) is presented. A knowledge base is built to facilitate system performance merits evaluation process. Even though many other parameters can be included in the performance merit set, at this stage only electrical performance merits such as module frequency, module size and power dissipation are modeled. The other performance merits (e.g., cost estimation, thermal resistance and reliability, and etc.) are to be included in future work.
UR - http://www.scopus.com/inward/record.url?scp=84909897736&partnerID=8YFLogxK
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U2 - 10.1109/EPEP.1992.572250
DO - 10.1109/EPEP.1992.572250
M3 - Conference contribution
AN - SCOPUS:84909897736
T3 - Electrical Performance of Electronic Packaging, EPEP 1992
SP - 7
EP - 9
BT - Electrical Performance of Electronic Packaging, EPEP 1992
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 1992 Electrical Performance of Electronic Packaging, EPEP 1992
Y2 - 22 April 1992 through 24 April 1992
ER -