Abstract
A simulation study of optical interconnects is described. Influences of electrical packaging technologies on laser source performance is evaluated. Various laser and driver types are considered together with ceramic board, film carrier and flip-chip connections.
| Original language | English (US) |
|---|---|
| Pages | 235-238 |
| Number of pages | 4 |
| State | Published - 1994 |
| Event | Proceedings of the 3rd Topical Meeting on Electrical Performance of Electronic Packaging - Monterey, CA, USA Duration: Nov 2 1994 → Nov 4 1994 |
Other
| Other | Proceedings of the 3rd Topical Meeting on Electrical Performance of Electronic Packaging |
|---|---|
| City | Monterey, CA, USA |
| Period | 11/2/94 → 11/4/94 |
ASJC Scopus subject areas
- General Engineering
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