Electrical packaging impact on source components in optical interconnects

M. A. Neifeld; Wu Chun Chou

Electrical packaging impact on source components in optical interconnects

M. A. Neifeld, Wu Chun Chou

Electrical and Computer Engineering

Research output: Contribution to conference › Paper › peer-review

Abstract

A simulation study of optical interconnects is described. Influences of electrical packaging technologies on laser source performance is evaluated. Various laser and driver types are considered together with ceramic board, film carrier and flip-chip connections.

Original language	English (US)
Pages	235-238
Number of pages	4
State	Published - 1994
Event	Proceedings of the 3rd Topical Meeting on Electrical Performance of Electronic Packaging - Monterey, CA, USA Duration: Nov 2 1994 → Nov 4 1994

Other

Other	Proceedings of the 3rd Topical Meeting on Electrical Performance of Electronic Packaging
City	Monterey, CA, USA
Period	11/2/94 → 11/4/94

ASJC Scopus subject areas

Engineering(all)

Cite this

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title = "Electrical packaging impact on source components in optical interconnects",

abstract = "A simulation study of optical interconnects is described. Influences of electrical packaging technologies on laser source performance is evaluated. Various laser and driver types are considered together with ceramic board, film carrier and flip-chip connections.",

author = "Neifeld, {M. A.} and Chou, {Wu Chun}",

year = "1994",

language = "English (US)",

pages = "235--238",

note = "Proceedings of the 3rd Topical Meeting on Electrical Performance of Electronic Packaging ; Conference date: 02-11-1994 Through 04-11-1994",

}

TY - CONF

T1 - Electrical packaging impact on source components in optical interconnects

AU - Neifeld, M. A.

AU - Chou, Wu Chun

PY - 1994

Y1 - 1994

N2 - A simulation study of optical interconnects is described. Influences of electrical packaging technologies on laser source performance is evaluated. Various laser and driver types are considered together with ceramic board, film carrier and flip-chip connections.

AB - A simulation study of optical interconnects is described. Influences of electrical packaging technologies on laser source performance is evaluated. Various laser and driver types are considered together with ceramic board, film carrier and flip-chip connections.

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M3 - Paper

AN - SCOPUS:0028732435

SP - 235

EP - 238

T2 - Proceedings of the 3rd Topical Meeting on Electrical Performance of Electronic Packaging

Y2 - 2 November 1994 through 4 November 1994

ER -

Electrical packaging impact on source components in optical interconnects

Abstract

Other

ASJC Scopus subject areas

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