TY - GEN
T1 - Elastic Strain Engineering for Ultralow Mechanical Dissipation
AU - Engelsen, Nils J.
AU - Ghadimi, Amir H.
AU - Fedorov, Sergey A.
AU - Kippenberg, Tobias J.
AU - Bereyhi, Mohammad J.
AU - Schilling, Ryan D.
AU - Wilson, Dalziel J.
N1 - Funding Information:
This work was supported by the EU Horizon 2020 Research and Innovation Program under grant agreement no. 732894 (FET Proactive HOT) and the SNF Cavity Quantum Optomechanics project (grant no. 163387). M.J.B. is supported by MSCA ETN-OMT (grant no. 722923). T.J.K acknowledges support from ERC AdG (QuREM, grant no. 320966). All samples were fabricated at the Center for MicroNanoTechnology (CMi) at EPFL.
Publisher Copyright:
© 2018 IEEE.
PY - 2018/9/4
Y1 - 2018/9/4
N2 - Extreme stresses can be produced in nanoscale structures, a feature which has been used to realize enhanced materials properties, such as the high mobility of silicon in modern transistors. Here we show how nanoscale stress can be used to realize exceptionally low mechanical dissipation, when combined with 'soft-clamping'-a form of phononic engineering. Specifically, using a non-uniform phononic crystal pattern, we colocalize the strain and flexural motion of a freestanding Si3N4 nanobeam. Ringdown measurements at room temperature reveal string-like modes with quality Q factors as high as 800 million and Q× frequency exceeding 1015Hz.
AB - Extreme stresses can be produced in nanoscale structures, a feature which has been used to realize enhanced materials properties, such as the high mobility of silicon in modern transistors. Here we show how nanoscale stress can be used to realize exceptionally low mechanical dissipation, when combined with 'soft-clamping'-a form of phononic engineering. Specifically, using a non-uniform phononic crystal pattern, we colocalize the strain and flexural motion of a freestanding Si3N4 nanobeam. Ringdown measurements at room temperature reveal string-like modes with quality Q factors as high as 800 million and Q× frequency exceeding 1015Hz.
KW - nanomechanics
KW - optomechanics
KW - strain engineering
UR - http://www.scopus.com/inward/record.url?scp=85053912875&partnerID=8YFLogxK
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U2 - 10.1109/OMN.2018.8454645
DO - 10.1109/OMN.2018.8454645
M3 - Conference contribution
AN - SCOPUS:85053912875
SN - 9781509063727
T3 - International Conference on Optical MEMS and Nanophotonics
BT - International Conference on Optical MEMS and Nanophotonics, OMN 2018 - Proceedings
PB - IEEE Computer Society
T2 - 23rd International Conference on Optical MEMS and Nanophotonics, OMN 2018
Y2 - 29 July 2018 through 2 August 2018
ER -