TY - GEN
T1 - Efficient full-wave analysis of packaging interconnects with bends using the method of moments
AU - Zhu, Zhaohui
AU - Dvorak, Steven L.
AU - Prince, John L.
N1 - Publisher Copyright:
© 2003 IEEE.
PY - 2003
Y1 - 2003
N2 - In this paper, a Method of Moments (MOM) based, Full-Wave Layered Interconnect Simulator, UAFWLIS is extended to handle interconnects with bends. The accuracy of this new bend-cell expansion function is investigated by comparing with Agilent Momentum.
AB - In this paper, a Method of Moments (MOM) based, Full-Wave Layered Interconnect Simulator, UAFWLIS is extended to handle interconnects with bends. The accuracy of this new bend-cell expansion function is investigated by comparing with Agilent Momentum.
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U2 - 10.1109/EPEP.2003.1250069
DO - 10.1109/EPEP.2003.1250069
M3 - Conference contribution
AN - SCOPUS:84945297767
T3 - Electrical Performance of Electronic Packaging
SP - 363
EP - 366
BT - Electrical Performance of Electronic Packaging
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - Electrical Performance of Electronic Packaging, 2003
Y2 - 27 October 2003 through 29 October 2003
ER -