Effect of various cleaning solutions and brush scrubber kinematics on the frictional attributes of post copper CMP cleaning process

Yasa Sampurno, Yun Zhuang, Xun Gu, Sian Theng, Takenao Nemoto, Ting Sun, Fransisca Sudargho, Akinobu Teramoto, Ara Philipossian, Tadahiro Ohmi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Scopus citations

Abstract

Brush scrubbing has been widely used in post chemical mechanical planarization (CMP) applications to remove contaminations, such as slurry residues and particles, from the wafer surface. During brush scrubbing, particle removal results from direct contact between a soft poly vinyl alcohol (PVA) brush and the wafer surface in which the brush asperities engulf the particles while the rotating motion of the brush, as well as the cleaning fluid at the surface, dislodge and carry the particles away from the wafer. The cleaning performance of brush scrubbing depends heavily on the choice of the cleaning solution and brush scrubber kinematics. In this work, the effect of various cleaning solutions and brush scrubber kinematics on the frictional attributes of post copper CMP cleaning process was investigated.

Original languageEnglish (US)
Title of host publicationUltra Clean Processing of Semiconductor Surfaces IX
Subtitle of host publicationUCPSS 2008
PublisherTrans Tech Publications Ltd
Pages363-366
Number of pages4
ISBN (Print)3908451647, 9783908451648
DOIs
StatePublished - 2009
Externally publishedYes
Event9th international symposium on Ultra Clean Processing of Semiconductor Surfaces, UCPSS 2008 - Bruges, Belgium
Duration: Sep 22 2008Sep 24 2008

Publication series

NameSolid State Phenomena
Volume145-146
ISSN (Print)1012-0394

Other

Other9th international symposium on Ultra Clean Processing of Semiconductor Surfaces, UCPSS 2008
Country/TerritoryBelgium
CityBruges
Period9/22/089/24/08

Keywords

  • Brush
  • Citric acid
  • Cleaning process
  • Cleaning solutions
  • Down force
  • Frictional force
  • PVA
  • Post copper CMP
  • Rotational rate
  • Shear force
  • Slurry
  • Surfactant

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Materials Science(all)
  • Condensed Matter Physics

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