TY - GEN
T1 - Effect of temperature on pad surface contact area in chemical mechanical planarization
AU - Jiao, Yubo
AU - Zhuang, Yun
AU - Han, Zhenxing
AU - Liao, Xiaoyan
AU - Sampuno, Yasa Adi
AU - Naman, Ananth
AU - Philipossian, Ara
PY - 2010
Y1 - 2010
N2 - In this study, the effect of temperature on pad surface contact area in chemical mechanical planarization was investigated. A custom-made sample holder was designed to heat the pad sample and measure the pad surface contact area under elevated temperatures. Results show that when the pad surface temperature increased from 25 to 35 °C, the contact area percentage increased from 0.029% to 0.051% under the pressure of 4 psi. When the pad surface temperature increased from 35 to 45 °C, the contact area percentage increased further to 0.092%.
AB - In this study, the effect of temperature on pad surface contact area in chemical mechanical planarization was investigated. A custom-made sample holder was designed to heat the pad sample and measure the pad surface contact area under elevated temperatures. Results show that when the pad surface temperature increased from 25 to 35 °C, the contact area percentage increased from 0.029% to 0.051% under the pressure of 4 psi. When the pad surface temperature increased from 35 to 45 °C, the contact area percentage increased further to 0.092%.
UR - http://www.scopus.com/inward/record.url?scp=79957642510&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=79957642510&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:79957642510
SN - 9781617822810
T3 - Advanced Metallization Conference (AMC)
SP - 286
EP - 287
BT - Advanced Metallization Conference 2010
T2 - Advanced Metallization Conference 2010
Y2 - 5 October 2010 through 7 October 2010
ER -