Effect of pad surface micro-texture on coefficient of friction and removal rate during copper CMP process

X. Liao; Y. Zhuang; L. J. Borucki; S. Theng; X. Wei; T. Ashizawa; A. Philipossian

doi:10.1149/1.3555072

Effect of pad surface micro-texture on coefficient of friction and removal rate during copper CMP process

X. Liao, Y. Zhuang, L. J. Borucki, S. Theng, X. Wei, T. Ashizawa, A. Philipossian

Research output: Contribution to journal › Article › peer-review

15 Scopus citations

Abstract

In this study, 200-mm blanket copper wafers were polished on an IC1010 M-groove pad, which was conditioned by a 3M A2810 disc and Mitsubishi Materials Corporation (MMC) TRD disc. Pad surface contact area and topography were analyzed using laser confocal microscopy and scanning electron microscopy. The MMC TRD disc generated a lot of large near contact areas corresponding to fractured and collapsed pore walls. The fractured and collapsed pore walls partly covered the adjacent pores, making the pad surface more lubricated during wafer polishing and rendering significantly lower coefficient of friction and removal rate than the 3M A2810 disc.

Original language	English (US)
Pages (from-to)	H201-H204
Journal	Electrochemical and Solid-State Letters
Volume	14
Issue number	5
DOIs	https://doi.org/10.1149/1.3555072
State	Published - 2011
Externally published	Yes

ASJC Scopus subject areas

General Chemical Engineering
General Materials Science
Physical and Theoretical Chemistry
Electrochemistry
Electrical and Electronic Engineering

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abstract = "In this study, 200-mm blanket copper wafers were polished on an IC1010 M-groove pad, which was conditioned by a 3M A2810 disc and Mitsubishi Materials Corporation (MMC) TRD disc. Pad surface contact area and topography were analyzed using laser confocal microscopy and scanning electron microscopy. The MMC TRD disc generated a lot of large near contact areas corresponding to fractured and collapsed pore walls. The fractured and collapsed pore walls partly covered the adjacent pores, making the pad surface more lubricated during wafer polishing and rendering significantly lower coefficient of friction and removal rate than the 3M A2810 disc.",

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T1 - Effect of pad surface micro-texture on coefficient of friction and removal rate during copper CMP process

AU - Liao, X.

AU - Zhuang, Y.

AU - Borucki, L. J.

AU - Theng, S.

AU - Wei, X.

AU - Ashizawa, T.

AU - Philipossian, A.

PY - 2011

Y1 - 2011

N2 - In this study, 200-mm blanket copper wafers were polished on an IC1010 M-groove pad, which was conditioned by a 3M A2810 disc and Mitsubishi Materials Corporation (MMC) TRD disc. Pad surface contact area and topography were analyzed using laser confocal microscopy and scanning electron microscopy. The MMC TRD disc generated a lot of large near contact areas corresponding to fractured and collapsed pore walls. The fractured and collapsed pore walls partly covered the adjacent pores, making the pad surface more lubricated during wafer polishing and rendering significantly lower coefficient of friction and removal rate than the 3M A2810 disc.

AB - In this study, 200-mm blanket copper wafers were polished on an IC1010 M-groove pad, which was conditioned by a 3M A2810 disc and Mitsubishi Materials Corporation (MMC) TRD disc. Pad surface contact area and topography were analyzed using laser confocal microscopy and scanning electron microscopy. The MMC TRD disc generated a lot of large near contact areas corresponding to fractured and collapsed pore walls. The fractured and collapsed pore walls partly covered the adjacent pores, making the pad surface more lubricated during wafer polishing and rendering significantly lower coefficient of friction and removal rate than the 3M A2810 disc.

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JF - Electrochemical and Solid-State Letters

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Effect of pad surface micro-texture on coefficient of friction and removal rate during copper CMP process

Abstract

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