Effect of pad groove width on slurry mean residence time and slurry utilization efficiency in CMP

Yan Mu; Yun Zhuang; Yasa Sampurno; Xiaomin Wei; Toranosuke Ashizawa; Hiroyuki Morishima; Ara Philipossian

doi:10.1016/j.mee.2016.02.035

Effect of pad groove width on slurry mean residence time and slurry utilization efficiency in CMP

Yan Mu, Yun Zhuang, Yasa Sampurno, Xiaomin Wei, Toranosuke Ashizawa, Hiroyuki Morishima, Ara Philipossian

Chemical and Environmental Engineering

Research output: Contribution to journal › Article › peer-review

26 Scopus citations

Abstract

This paper studies the effect of pad groove width on slurry mean residence time (MRT) in the pad-wafer interface as well as slurry utilization efficiency (η) during chemical mechanical planarization. Three concentrically grooved pads with different groove widths were tested at different polishing pressures to experimentally determine the corresponding MRT using the residence time distribution (RTD) technique. Results showed that MRT and η increased significantly when the groove width increased from 300 to 600 μm. On the other hand, when the groove width increased further to 900 μm, MRT continued to increase while η remained constant. Results also indicated that MRT was reduced at a higher polishing pressure while η did not change significantly with pressure for all three pads.

Original language	English (US)
Pages (from-to)	60-63
Number of pages	4
Journal	Microelectronic Engineering
Volume	157
DOIs	https://doi.org/10.1016/j.mee.2016.02.035
State	Published - May 1 2016

Keywords

Chemical mechanical planarization
Mean residence time
Slurry utilization efficiency

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Condensed Matter Physics
Surfaces, Coatings and Films
Electrical and Electronic Engineering

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10.1016/j.mee.2016.02.035

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title = "Effect of pad groove width on slurry mean residence time and slurry utilization efficiency in CMP",

abstract = "This paper studies the effect of pad groove width on slurry mean residence time (MRT) in the pad-wafer interface as well as slurry utilization efficiency (η) during chemical mechanical planarization. Three concentrically grooved pads with different groove widths were tested at different polishing pressures to experimentally determine the corresponding MRT using the residence time distribution (RTD) technique. Results showed that MRT and η increased significantly when the groove width increased from 300 to 600 μm. On the other hand, when the groove width increased further to 900 μm, MRT continued to increase while η remained constant. Results also indicated that MRT was reduced at a higher polishing pressure while η did not change significantly with pressure for all three pads.",

keywords = "Chemical mechanical planarization, Mean residence time, Slurry utilization efficiency",

author = "Yan Mu and Yun Zhuang and Yasa Sampurno and Xiaomin Wei and Toranosuke Ashizawa and Hiroyuki Morishima and Ara Philipossian",

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doi = "10.1016/j.mee.2016.02.035",

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TY - JOUR

T1 - Effect of pad groove width on slurry mean residence time and slurry utilization efficiency in CMP

AU - Mu, Yan

AU - Zhuang, Yun

AU - Sampurno, Yasa

AU - Wei, Xiaomin

AU - Ashizawa, Toranosuke

AU - Morishima, Hiroyuki

AU - Philipossian, Ara

PY - 2016/5/1

Y1 - 2016/5/1

N2 - This paper studies the effect of pad groove width on slurry mean residence time (MRT) in the pad-wafer interface as well as slurry utilization efficiency (η) during chemical mechanical planarization. Three concentrically grooved pads with different groove widths were tested at different polishing pressures to experimentally determine the corresponding MRT using the residence time distribution (RTD) technique. Results showed that MRT and η increased significantly when the groove width increased from 300 to 600 μm. On the other hand, when the groove width increased further to 900 μm, MRT continued to increase while η remained constant. Results also indicated that MRT was reduced at a higher polishing pressure while η did not change significantly with pressure for all three pads.

AB - This paper studies the effect of pad groove width on slurry mean residence time (MRT) in the pad-wafer interface as well as slurry utilization efficiency (η) during chemical mechanical planarization. Three concentrically grooved pads with different groove widths were tested at different polishing pressures to experimentally determine the corresponding MRT using the residence time distribution (RTD) technique. Results showed that MRT and η increased significantly when the groove width increased from 300 to 600 μm. On the other hand, when the groove width increased further to 900 μm, MRT continued to increase while η remained constant. Results also indicated that MRT was reduced at a higher polishing pressure while η did not change significantly with pressure for all three pads.

KW - Chemical mechanical planarization

KW - Mean residence time

KW - Slurry utilization efficiency

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SP - 60

EP - 63

JO - Microelectronic Engineering

JF - Microelectronic Engineering

ER -

Effect of pad groove width on slurry mean residence time and slurry utilization efficiency in CMP

Abstract

Keywords

ASJC Scopus subject areas

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