Drop-shock failure prediction in electronic packages by using peridynamic theory

Abigail Agwai, Ibrahim Guven, Erdogan Madenci

Research output: Contribution to journalArticlepeer-review

14 Scopus citations


Peridynamic (PD) theory is used to investigate the dynamic responses of electronic packages subjected to impact loading arising from drop-shock. The capability of the PD theory to predict failure is demonstrated by simulating a drop test experiment of a laboratory-type package. The failure predictions and observations are exceptionally similar. For the drop test simulation of a production-type package, the finite element method (FEM) and PD theory are coupled via a submodeling approach. The global modeling is performed using the FEM while the PD theory is employed for the submodeling and failure prediction. The analysis yielded the outermost solder joint as the critical joint, with failure at the interface between the solder and copper pad on the printed circuit board side.

Original languageEnglish (US)
Article number6142056
Pages (from-to)439-447
Number of pages9
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Issue number3
StatePublished - Mar 2012


  • Cracking
  • drop-shock
  • failure
  • interface
  • peridynamics

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering


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