TY - JOUR
T1 - Dramatic improvements in the matrix solution time for method of moment problems involving stripline interconnects
AU - Wang, Xing
AU - Zhu, Zhaohui
AU - Cao, Yi
AU - Dvorak, Steven L.
AU - Prince, John L.
N1 - Funding Information:
Manuscript received March 20, 2006; revised January 10, 2007. This work was supported by the Semiconductor Research Corporation (SRC) under contract 2005-KC-1292.024 and was carried out at the University of Arizona. This paper was presented in part at the 56th Electronic Components and Technology ConferenceSan Diego, CA,May2006. X. Wang is with NVIDIA Corporation, 2701 San Tomas Expressway, Santa Clara, CA 95050 USA. Z. Zhu is with Intel Corporation, Chandler, AZ 85226 USA. Y. Cao and S. L. Dvorak are with the Department of Electrical and Computer Engineering, The University of Arizona, Tucson, AZ 85721 USA (e-mail: [email protected]). J. L. Prince, deceased, was with the Department of Electrical and Computer Engineering, The University of Arizona, Tucson, AZ 85721 USA. Color versions of one or more of the figures in this paper are available online at http://ieeexplore.ieee.org. Digital Object Identifier 10.1109/TADVP.2007.898638
PY - 2007/8
Y1 - 2007/8
N2 - Method of moments (MoM) reaction matrices are typically thought of as being full matrices in most applications. However, in this paper, we demonstrate for the first time that sparse reaction matrices are produced when modeling stripline interconnects provided that a parallel-plate Green's function is employed in the analysis. This is demonstrated by investigating the sparse nature of the MoM reaction matrices that are produced when using the full-wave layered interconnect solver (UA-FWLIS) to model stripline interconnects. In order to explain the sparse nature of the reaction matrices, the electric fields that are excited by horizontal and vertical electric dipole sources are briefly overviewed, and the cutoff mode behavior of these electric fields is studied. Then the variations of the reaction elements with distance are studied, and this information is used to provide a cutoff criterion for the reaction element calculations. Once the reasons for the matrix sparsity have been explained, then we test various matrix solution algorithms in order to determine their efficiencies. We found that by applying sparse matrix storage techniques and a sparse matrix solver, it is possible to dramatically improve the matrix solution time when compared with a commercial MoM-based simulator.
AB - Method of moments (MoM) reaction matrices are typically thought of as being full matrices in most applications. However, in this paper, we demonstrate for the first time that sparse reaction matrices are produced when modeling stripline interconnects provided that a parallel-plate Green's function is employed in the analysis. This is demonstrated by investigating the sparse nature of the MoM reaction matrices that are produced when using the full-wave layered interconnect solver (UA-FWLIS) to model stripline interconnects. In order to explain the sparse nature of the reaction matrices, the electric fields that are excited by horizontal and vertical electric dipole sources are briefly overviewed, and the cutoff mode behavior of these electric fields is studied. Then the variations of the reaction elements with distance are studied, and this information is used to provide a cutoff criterion for the reaction element calculations. Once the reasons for the matrix sparsity have been explained, then we test various matrix solution algorithms in order to determine their efficiencies. We found that by applying sparse matrix storage techniques and a sparse matrix solver, it is possible to dramatically improve the matrix solution time when compared with a commercial MoM-based simulator.
KW - Conjugate gradient
KW - Integral equation
KW - Interconnects
KW - Method of moments (MOM)
KW - Sparse matrix
KW - Stripline
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U2 - 10.1109/TADVP.2007.898638
DO - 10.1109/TADVP.2007.898638
M3 - Article
AN - SCOPUS:34548188757
SN - 1521-3323
VL - 30
SP - 570
EP - 579
JO - IEEE Transactions on Advanced Packaging
JF - IEEE Transactions on Advanced Packaging
IS - 3
ER -