TY - JOUR
T1 - Dissolution of copper thin films in hydroxylamine-based solutions
AU - Huang, Wayne
AU - Tamilmani, Subramanian
AU - Raghavan, Srini
AU - Small, Robert
N1 - Funding Information:
The work was funded by a grant from EKC Technology, Hayward, California and the NSF-SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing at the University of Arizona.
PY - 2003/9/29
Y1 - 2003/9/29
N2 - Chemical mechanical planarization (CMP) of copper, a key processing step in the rapid development of copper interconnect technology, requires the use of a chemical system that can oxidize and complex copper. Hydroxylamine, because of its redox properties and copper complexation ability, is being actively tested for use in copper CMP. Fundamental investigations have been carried out to characterize the dissolution of electroplated copper thin films in hydroxylamine-based solutions. Based on potential-pH diagrams and the data on dependence of copper etch rate on pH, a mechanism for copper dissolution based on the auto-oxidation/reduction of hydroxylamine has been proposed. The effectiveness of benzotriazole (BTA) and salicylhydroxamic acid (SHA) as corrosion inhibitors for copper in hydroxylamine-based chemistries is discussed.
AB - Chemical mechanical planarization (CMP) of copper, a key processing step in the rapid development of copper interconnect technology, requires the use of a chemical system that can oxidize and complex copper. Hydroxylamine, because of its redox properties and copper complexation ability, is being actively tested for use in copper CMP. Fundamental investigations have been carried out to characterize the dissolution of electroplated copper thin films in hydroxylamine-based solutions. Based on potential-pH diagrams and the data on dependence of copper etch rate on pH, a mechanism for copper dissolution based on the auto-oxidation/reduction of hydroxylamine has been proposed. The effectiveness of benzotriazole (BTA) and salicylhydroxamic acid (SHA) as corrosion inhibitors for copper in hydroxylamine-based chemistries is discussed.
KW - Copper CMP
KW - Corrosion inhibitors
KW - Hydroxylamine
UR - http://www.scopus.com/inward/record.url?scp=0141794080&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=0141794080&partnerID=8YFLogxK
U2 - 10.1016/S0301-7516(03)00111-X
DO - 10.1016/S0301-7516(03)00111-X
M3 - Article
AN - SCOPUS:0141794080
SN - 0301-7516
VL - 72
SP - 365
EP - 372
JO - International Journal of Mineral Processing
JF - International Journal of Mineral Processing
IS - 1-4
ER -