Development of hybridized focal plane technologies

Michael Lesser, David Ouellette

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Scopus citations


Large area focal planes for the next generation of astronomical instruments require very flat imaging surfaces (< 10 μm peak-valley) over significant sizes (20 - 100 cm), accurate alignment of detector height, stable operation at low temperature, and fully-buttable packaging with large I/O requirements to connect multiple amplifiers per detector. These requirements are often mutually exclusive and therefore difficult to obtain in a single focal plane. In this paper we discuss the hybridization or flip chip bonding technique and associated focal plane mounting methods to achieve these goals. Specifically, we describe a technique to hybridize CCD detectors onto high thermal conductivity ceramic with vias that lead to the I/O signals underneath the detectors. Packaging methods to mount such devices with a total flatness non-uniformity of less than 10 microns are presented. The requirements of achieving sub-5 microns flatness are also discussed.

Original languageEnglish (US)
Title of host publicationHigh Energy, Optical, and Infrared Detectors for Astronomy II
StatePublished - 2006
EventHigh Energy, Optical, and Infrared Detectors for Astronomy II - Orlando, FL, United States
Duration: May 24 2006May 27 2006

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
ISSN (Print)0277-786X


OtherHigh Energy, Optical, and Infrared Detectors for Astronomy II
Country/TerritoryUnited States
CityOrlando, FL


  • CCD
  • Charge-coupled device
  • Detector
  • Focal plane
  • Hybridization, astronomy
  • Telescope

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering


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