Abstract
This paper presents radio frequency data transmissions via 60-GHz antennas or wireless interconnects in multichip multicore computing architectures. An antenna in package is used as the design configuration to be placed on top of the silicon circuitry. The packaging design includes an artificial magnetic conductor to enhance the operating bandwidth, a two-element antenna array to increase the transmission gain, and an integrated power divider. This paper compares the wireless link budget of antenna-based interconnects in terms of the Friis transmission equation. This defines the power needed to be recovered by wireless transceivers (PRE). The design demonstrates an 11 GHz measured operating bandwidth and shows that with a two-element array; the P RE is reduced by 10 dB over that with a link that uses a single antenna.
| Original language | English (US) |
|---|---|
| Article number | 6570734 |
| Pages (from-to) | 1946-1952 |
| Number of pages | 7 |
| Journal | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| Volume | 3 |
| Issue number | 11 |
| DOIs | |
| State | Published - 2013 |
Keywords
- 60 GHz antennas
- Electronic packaging design
- Radio frequency (RF) interconnects
- Wireless link budget
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Industrial and Manufacturing Engineering
- Electrical and Electronic Engineering