Design of a high-speed optical interconnect for scalable shared memory multiprocessors

Avinash Karanth Kodi, Ahmed Louri

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Scopus citations

Abstract

This paper proposes a highly connected optical interconnect based architecture that maximizes the channel availability for future scalable parallel computers such as Distributed Shared Memory (DSM) multiprocessors and cluster networks. As the system size increases, various messages (requests, responses and acknowledgments) increase in the network resulting in contention. This results in increasing the remote memory access latency and significantly affects the performance of these parallel computers. As a solution, we propose an architecture called RAPID (Reconfigurable and scalable All-Photonic Interconnect for Distributed-shared memory), that provides low remote memory access latency by providing fast and efficient unicast, multicast and broadcast capabilities using a combination of aggressively designed WDM, TDM and SDM techniques. We evaluated RAPID based on network characteristics and by simulation using synthetic traffic workloads and compared it against other networks such as electrical ring, torus, mesh and hypercube networks. We found that RAPID outperforms all networks and satisfies most of the requirements of parallel computer design such as low latency, high bandwidth, high connectivity, and easy scalability.

Original languageEnglish (US)
Title of host publicationProceedings - 12th Annual IEEE Symposium on High Performance Interconnects, Hot Interconnects
EditorsS. Watters
Pages92-97
Number of pages6
DOIs
StatePublished - 2004
EventProceedings - 12th Annual IEEE Symposium on High Performance Interconnects, Hot Interconnects - Stanford, CA, United States
Duration: Aug 25 2004Aug 27 2004

Publication series

NameProceedings - 12th Annual IEEE Symposium on High Performance Interconnects, Hot Interconnects

Other

OtherProceedings - 12th Annual IEEE Symposium on High Performance Interconnects, Hot Interconnects
Country/TerritoryUnited States
CityStanford, CA
Period8/25/048/27/04

ASJC Scopus subject areas

  • General Engineering

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