TY - GEN
T1 - Damage prediction in graphene thermoplastics for potential electronic packaging applications
AU - Oterkus, Erkan
AU - Madenci, Erdogan
PY - 2011
Y1 - 2011
N2 - Graphene is a promising material for electronics industry due to its unique mechanical and electronic properties. In this study, the failure analysis of the graphene sheets is performed by using Peridynamic theory due to its unique capability in failure prediction at the continuum level and the similarity of its mathematical structure to the molecular dynamic simulations (MDS). The current approach is validated against MDS predictions by considering zig-zag and armchair type single layer graphene sheets with an initial edge notch subjected to tension loading. Finally, a similar analysis is performed for multi-layered graphene layers which are either commensurate or incommensurate to investigate the effect of number of zigzag and armchair type graphene sheets and their stacking sequence on failure modes.
AB - Graphene is a promising material for electronics industry due to its unique mechanical and electronic properties. In this study, the failure analysis of the graphene sheets is performed by using Peridynamic theory due to its unique capability in failure prediction at the continuum level and the similarity of its mathematical structure to the molecular dynamic simulations (MDS). The current approach is validated against MDS predictions by considering zig-zag and armchair type single layer graphene sheets with an initial edge notch subjected to tension loading. Finally, a similar analysis is performed for multi-layered graphene layers which are either commensurate or incommensurate to investigate the effect of number of zigzag and armchair type graphene sheets and their stacking sequence on failure modes.
UR - http://www.scopus.com/inward/record.url?scp=79960401131&partnerID=8YFLogxK
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U2 - 10.1109/ECTC.2011.5898814
DO - 10.1109/ECTC.2011.5898814
M3 - Conference contribution
AN - SCOPUS:79960401131
SN - 9781612844978
T3 - Proceedings - Electronic Components and Technology Conference
SP - 2134
EP - 2140
BT - 2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011
T2 - 2011 61st Electronic Components and Technology Conference, ECTC 2011
Y2 - 31 May 2011 through 3 June 2011
ER -