Damage prediction for electronic package drop test using finite element method and peridynamic theory

Abigail Agwai; Ibrahim Guven; Erdogan Madenci

doi:10.1109/ECTC.2009.5074069

Damage prediction for electronic package drop test using finite element method and peridynamic theory

Abigail Agwai, Ibrahim Guven, Erdogan Madenci

Aerospace and Mechanical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

24 Scopus citations

Abstract

Finite element method and peridynamic theory are coupled via submodeling approach to investigate the dynamic response and damage in an electronic package subjected to impact loading arising from drop-shock. The global modeling is performed using the finite element method while the peridynamic theory is employed for the submodeling and failure prediction. The analysis yielded the outermost solder joint as the critical joint with failure at the interface between the solder and copper pad on the PCB side.

Original language	English (US)
Title of host publication	2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009
Pages	565-569
Number of pages	5
DOIs	https://doi.org/10.1109/ECTC.2009.5074069
State	Published - 2009
Event	2009 59th Electronic Components and Technology Conference, ECTC 2009 - San Diego, CA, United States Duration: May 26 2009 → May 29 2009

Publication series

Name	Proceedings - Electronic Components and Technology Conference
ISSN (Print)	0569-5503

Other

Other	2009 59th Electronic Components and Technology Conference, ECTC 2009
Country/Territory	United States
City	San Diego, CA
Period	5/26/09 → 5/29/09

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/ECTC.2009.5074069

Cite this

Damage prediction for electronic package drop test using finite element method and peridynamic theory. / Agwai, Abigail; Guven, Ibrahim; Madenci, Erdogan.
2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009. 2009. p. 565-569 5074069 (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Agwai, A, Guven, I & Madenci, E 2009, Damage prediction for electronic package drop test using finite element method and peridynamic theory. in 2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009., 5074069, Proceedings - Electronic Components and Technology Conference, pp. 565-569, 2009 59th Electronic Components and Technology Conference, ECTC 2009, San Diego, CA, United States, 5/26/09. https://doi.org/10.1109/ECTC.2009.5074069

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AB - Finite element method and peridynamic theory are coupled via submodeling approach to investigate the dynamic response and damage in an electronic package subjected to impact loading arising from drop-shock. The global modeling is performed using the finite element method while the peridynamic theory is employed for the submodeling and failure prediction. The analysis yielded the outermost solder joint as the critical joint with failure at the interface between the solder and copper pad on the PCB side.

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Damage prediction for electronic package drop test using finite element method and peridynamic theory

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