TY - GEN
T1 - Creating a monolithic, low insertion loss, photonic chip for the FIRST instrument
AU - Goldsmith, Harry Dean Kenchington
AU - Huby, Elsa
AU - Barjot, Kevin
AU - Lallement, Manon
AU - Rouan, Daniel
AU - Martin, Guillermo
AU - Vievard, Sebastien
AU - Guyon, Olivier
AU - Deo, Vincent
AU - Pham, Cecil
AU - Cassagnettes, Cedric
AU - Billat, Adrien
AU - Lacour, Sylvestre
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - The lure of photonics is undeniable. By replacing bulk optical components, fibre optics and fibre optic bundles, with monolithic photonic chips; astronomers are reducing environmental noise and increasing sensitivity in their interferometric measurements. Future photonic chips will be more complex and more compact and are the future for both ground-based and space-bound telescopes.
AB - The lure of photonics is undeniable. By replacing bulk optical components, fibre optics and fibre optic bundles, with monolithic photonic chips; astronomers are reducing environmental noise and increasing sensitivity in their interferometric measurements. Future photonic chips will be more complex and more compact and are the future for both ground-based and space-bound telescopes.
UR - http://www.scopus.com/inward/record.url?scp=85175726097&partnerID=8YFLogxK
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U2 - 10.1109/CLEO/EUROPE-EQEC57999.2023.10232656
DO - 10.1109/CLEO/EUROPE-EQEC57999.2023.10232656
M3 - Conference contribution
AN - SCOPUS:85175726097
T3 - 2023 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference, CLEO/Europe-EQEC 2023
BT - 2023 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference, CLEO/Europe-EQEC 2023
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2023 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference, CLEO/Europe-EQEC 2023
Y2 - 26 June 2023 through 30 June 2023
ER -