Abstract
Electronic packages usually consist of bonded materials with different thermal and mechanical properties. Interfaces of dissimilar materials are, therefore, prone to crack initiations, which lead to delaminations. It is then necessary to develop an in-depth understanding of the analytical modeling of the interface separating two dissimilar materials. Predictions of the location and onset of failure can be made through an accurate stress analysis in conjunction with the application of fracture mechanics concepts.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 970-976 |
| Number of pages | 7 |
| Journal | Proceedings - Electronic Components and Technology Conference |
| State | Published - 1995 |
| Event | Proceedings of the 1995 45th Electronic Components & Technology Conference - Las Vegas, NV, USA Duration: May 21 1995 → May 24 1995 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering