Fingerprint
Dive into the research topics of 'Coupled BEM and FEM analysis of functionally graded underfill layers in electronic packages'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Coupled BEM and FEM analysis of functionally graded underfill layers in electronic packages
M. Das, I. Guven, E. Madenci
Research output: Contribution to journal › Conference article › peer-review
1
Scopus
citations