Contactless bottom-up electrodeposition of nickel for 3D integrated circuits

  • Mingrui Zhao
  • , Rajesh Balachandran
  • , Zach Patterson
  • , Roman Gouk
  • , Steven Verhaverbeke
  • , Farhang Shadman
  • , Manish K Keswani

Research output: Contribution to journal › Article › peer-review

8   Link opens in a new tab Scopus citations

Fingerprint

Dive into the research topics of 'Contactless bottom-up electrodeposition of nickel for 3D integrated circuits'. Together they form a unique fingerprint.
Sort by

Material Science

Keyphrases

Engineering

Chemical Engineering