Contactless bottom-up electrodeposition of nickel for 3D integrated circuits

Mingrui Zhao, Rajesh Balachandran, Zach Patterson, Roman Gouk, Steven Verhaverbeke, Farhang Shadman, Manish K Keswani

Research output: Contribution to journal › Article › peer-review

8 Scopus citations

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Material Science

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Engineering

Chemical Engineering