Abstract
Temperature cycling tests are used to determine the number of cycles to failure of the solder joints in the surface mount technology packages. In this paper the thermomechanical fatigue of Pb40/Sn60 solder joint in a leadless ceramic chip carrier package is studied and Hall [1984] temperature cycling test is simulated by using a finite element procedure with the Disturbed State Concept (DSC) constitutive models. The progress of disturbance (damage) and the energy dissipated in the solder joint during thermal cycling are predicted. It is shown that the disturbance criterion used follows a similar path as the energy dissipation in the system. Moreover, the comparisons between the test data and the finite element analysis show that the number of cycles to failure of a solder joint can be accurately predicted by a finite element procedure using the DSC material models. Furthermore, the analysis give a good picture of the progress of the failure mechanism and the disturbance in the solder joint.
| Original language | English (US) |
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| Pages | 77-82 |
| Number of pages | 6 |
| State | Published - 1995 |
| Externally published | Yes |
| Event | Proceedings of the 1995 ASME International Mechanical Engineering Congress and Exposition - San Francisco, CA, USA Duration: Nov 12 1995 → Nov 17 1995 |
Other
| Other | Proceedings of the 1995 ASME International Mechanical Engineering Congress and Exposition |
|---|---|
| City | San Francisco, CA, USA |
| Period | 11/12/95 → 11/17/95 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Mechanical Engineering