TY - JOUR
T1 - Compact, Low-Profile, Bandwidth-Enhanced Substrate Integrated Waveguide Filtenna
AU - Hu, Kun Zhi
AU - Tang, Ming Chun
AU - Li, Mei
AU - Ziolkowski, Richard W.
N1 - Funding Information:
Manuscript received May 25, 2018; revised July 4, 2018; accepted July 7, 2018. Date of publication July 11, 2018; date of current version August 2, 2018. This work was supported in part by the Graduate Scientific Research and Innovation Foundation of Chongqing, China under Contract no. CYS18062; in part by the National Natural Science Foundation of China under Contract no. 61471072 and Contract no. 61701052; in part by the Funding of the leading research talent cultivation plan of the Chongqing University under Contract no. cqu2017hbrc1A08; in part by the Fundamental Research Funds for the Central Universities under Contract no. 2018CDQYTX0025; in part by the opening subject of the State Key Laboratory of Millimeter Waves under Contract no. K201732; and in part by the Australian Research Council under Grant DP160102219. (Corresponding author: Ming-Chun Tang.) K.-Z. Hu, M.-C. Tang, and M. Li are with the Key Laboratory of Dependable Service Computing in Cyber Physical Society Ministry of Education, College of Communication Engineering, Chongqing University, Chongqing 400044, China, and also with the State Key Laboratory of Millimeter Waves, Nanjing 210096, China (e-mail:, hukunzhi@cqu.edu.cn; tangmingchun@cqu.edu.cn; li.mei@cqu.edu.cn).
Publisher Copyright:
© 2011 IEEE.
PY - 2018/8
Y1 - 2018/8
N2 - In this letter, a compact, low-profile, bandwidth-enhanced, dual-cavity substrate integrated waveguide (SIW) filtenna is demonstrated. Two SIW cavities are stacked vertically on top of each other. A complementary split-ring resonator slot is etched in the top surface of the uppermost cavity, causing the top surface to act as a patch antenna. The operational impedance bandwidth is significantly enhanced by merging the three resonances that arise from this configuration. One is introduced by the patch, and the other two are inherently generated by the two cavities. A metallized coupling post is introduced from the ground plane through both cavities to the upper surface to excite the fundamental resonant mode of the patch, as well as to electromagnetically couple the two cavities. The optimized filtenna was fabricated by a standard printed circuit board technology and tested. It has a low profile λ 0 and a compact size 0.62λ 0×0.62λ0 at its center frequency, f0=2.95GHz. The measured results agree well with their simulated values. They demonstrate a 6.3% fractional bandwidth, a maximum realized gain of 6.73 dBi, a flat gain profile within its passband, and an excellent out-of-band selectivity.
AB - In this letter, a compact, low-profile, bandwidth-enhanced, dual-cavity substrate integrated waveguide (SIW) filtenna is demonstrated. Two SIW cavities are stacked vertically on top of each other. A complementary split-ring resonator slot is etched in the top surface of the uppermost cavity, causing the top surface to act as a patch antenna. The operational impedance bandwidth is significantly enhanced by merging the three resonances that arise from this configuration. One is introduced by the patch, and the other two are inherently generated by the two cavities. A metallized coupling post is introduced from the ground plane through both cavities to the upper surface to excite the fundamental resonant mode of the patch, as well as to electromagnetically couple the two cavities. The optimized filtenna was fabricated by a standard printed circuit board technology and tested. It has a low profile λ 0 and a compact size 0.62λ 0×0.62λ0 at its center frequency, f0=2.95GHz. The measured results agree well with their simulated values. They demonstrate a 6.3% fractional bandwidth, a maximum realized gain of 6.73 dBi, a flat gain profile within its passband, and an excellent out-of-band selectivity.
KW - Bandwidth
KW - compact antenna
KW - filtenna
KW - low-profile antenna
KW - patch antenna
KW - substrate integrated waveguide (SIW)
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U2 - 10.1109/LAWP.2018.2854898
DO - 10.1109/LAWP.2018.2854898
M3 - Article
AN - SCOPUS:85049774787
VL - 17
SP - 1552
EP - 1556
JO - IEEE Antennas and Wireless Propagation Letters
JF - IEEE Antennas and Wireless Propagation Letters
SN - 1536-1225
IS - 8
M1 - 8409954
ER -