TY - GEN
T1 - Combined peridynamic theory and kinetic theory of fracture for solder joint fatigue life prediction
AU - Madenci, E.
AU - Diyaroglu, C.
AU - Zhang, Y.
AU - Baber, F.
AU - Guven, I.
N1 - Publisher Copyright:
© 2020 IEEE.
PY - 2020/6
Y1 - 2020/6
N2 - This study presents an approach that combines the kinetic theory of fracture with peridynamic theory to predict solder joint fatigue life in electronic packages. It is applied to two different package types whose measured life values are reported in literature. The nonlinear finite element analyses of the global package model and sub-model of the critical joint provide the boundary conditions for the peridynamic model. Both the finite element and peridynamic analyses are performed in the ANSYS framework by using the available elements and options. This new approach captures the experimentally observed damage topology in a solder joint. Although the initial and final fatigue life predictions are acceptable, the predictions can certainly be improved with accurate values of activation energy and activation volume for materials employed in the package.
AB - This study presents an approach that combines the kinetic theory of fracture with peridynamic theory to predict solder joint fatigue life in electronic packages. It is applied to two different package types whose measured life values are reported in literature. The nonlinear finite element analyses of the global package model and sub-model of the critical joint provide the boundary conditions for the peridynamic model. Both the finite element and peridynamic analyses are performed in the ANSYS framework by using the available elements and options. This new approach captures the experimentally observed damage topology in a solder joint. Although the initial and final fatigue life predictions are acceptable, the predictions can certainly be improved with accurate values of activation energy and activation volume for materials employed in the package.
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U2 - 10.1109/ECTC32862.2020.00049
DO - 10.1109/ECTC32862.2020.00049
M3 - Conference contribution
AN - SCOPUS:85090274412
T3 - Proceedings - Electronic Components and Technology Conference
SP - 236
EP - 248
BT - Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 70th IEEE Electronic Components and Technology Conference, ECTC 2020
Y2 - 3 June 2020 through 30 June 2020
ER -