Closure to "Discussion of yield function for solder elastoviscoplastic modeling'" (2005, ASME J. Electron. Packag., 127, pp. 147-156)

Research output: Contribution to journal › Comment/debate › peer-review

Original language	English (US)
Article number	045502
Journal	Journal of Electronic Packaging
Volume	133
Issue number	4
DOIs	https://doi.org/10.1115/1.4000902
State	Published - 2011

ASJC Scopus subject areas

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title = "Closure to {"}Discussion of yield function for solder elastoviscoplastic modeling'{"} (2005, ASME J. Electron. Packag., 127, pp. 147-156)",

author = "M. Dube and T. Kundu",

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journal = "Journal of Electronic Packaging",

issn = "1043-7398",

publisher = "American Society of Mechanical Engineers (ASME)",

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AU - Dube, M.

AU - Kundu, T.

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