Closure to "Discussion of yield function for solder elastoviscoplastic modeling'" (2005, ASME J. Electron. Packag., 127, pp. 147-156)

M. Dube, T. Kundu

Research output: Contribution to journalComment/debatepeer-review

2 Scopus citations
Original languageEnglish (US)
Article number045502
JournalJournal of Electronic Packaging, Transactions of the ASME
Issue number4
StatePublished - 2011

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Computer Science Applications
  • Electrical and Electronic Engineering

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