TY - JOUR
T1 - Closed-loop electroosmotic microchannel cooling system for VLSI circuits
AU - Jiang, Linan
AU - Mikkelsen, James
AU - Koo, Jae Mo
AU - Huber, David
AU - Yao, Shuhuai
AU - Zhang, Lian
AU - Zhou, Peng
AU - Maveety, James G.
AU - Prasher, Ravi
AU - Santiago, Juan G.
AU - Kenny, Thomas W.
AU - Goodson, Kenneth E.
N1 - Funding Information:
Manuscript received March 22, 2001; revised March 20, 2002. This paper was presented at the 17th annual IEEE Semiconductor Thermal Measurement and Management Symposium, San Jose, CA, March 20–22, 2001. This work is supported by DARPA HERETIC under Program 9832-035.This work was recommended for publication by Guest Editors V. P. Manno, R. E. Simons, and J. Wilson.
PY - 2002/9
Y1 - 2002/9
N2 - The increasing heat generation rates in VLSI circuits motivate research on compact cooling technologies with low thermal resistance. This paper develops a closed-loop two-phase microchannel cooling system using electroosmotic pumping for the working fluid. The design, fabrication, and open-loop performance of the heat exchanger and pump are summarized. The silicon heat exchanger, which attaches to the test chip (1 cm2), achieves junction-fluid resistance near 0.1 K/W using 40 plasma-etched channels with hydraulic diameter of 100 μm. The electroosmotic pump, made of an ultrafine porous glass frit with working volume of 1.4 cm3, achieves maximum backpressure and flowrate of 160 KPa and 7 ml/min, respectively, using 1 mM buffered de-ionized water as working fluid. The closed-loop system removes 38 W with pump power of 2 W and junction-ambient thermal resistance near 2.5 K/W. Further research is expected to strongly reduce the thermal resistance for a given heating power by optimizing the saturation temperature, increasing the pump flowrate, eliminating the thermal grease, and optimizing the heat exchanger dimensions.
AB - The increasing heat generation rates in VLSI circuits motivate research on compact cooling technologies with low thermal resistance. This paper develops a closed-loop two-phase microchannel cooling system using electroosmotic pumping for the working fluid. The design, fabrication, and open-loop performance of the heat exchanger and pump are summarized. The silicon heat exchanger, which attaches to the test chip (1 cm2), achieves junction-fluid resistance near 0.1 K/W using 40 plasma-etched channels with hydraulic diameter of 100 μm. The electroosmotic pump, made of an ultrafine porous glass frit with working volume of 1.4 cm3, achieves maximum backpressure and flowrate of 160 KPa and 7 ml/min, respectively, using 1 mM buffered de-ionized water as working fluid. The closed-loop system removes 38 W with pump power of 2 W and junction-ambient thermal resistance near 2.5 K/W. Further research is expected to strongly reduce the thermal resistance for a given heating power by optimizing the saturation temperature, increasing the pump flowrate, eliminating the thermal grease, and optimizing the heat exchanger dimensions.
KW - Electroosmotic pump
KW - IC cooling technology
KW - Microchannel heat exchanger
KW - Two-phase heat transfer
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U2 - 10.1109/TCAPT.2002.800599
DO - 10.1109/TCAPT.2002.800599
M3 - Article
AN - SCOPUS:0036767898
SN - 1521-3331
VL - 25
SP - 347
EP - 355
JO - IEEE Transactions on Components and Packaging Technologies
JF - IEEE Transactions on Components and Packaging Technologies
IS - 3
ER -