Characterizing recycled fumed silica slurries in ILD CMP applications

Ara Philipossian; Farhang Shadman; Patrick Levy; Saied Tousi; Barry Gotlinsk; W. Scott Rader; Paul Lefevre; Isamu Koshiyama

Characterizing recycled fumed silica slurries in ILD CMP applications

Ara Philipossian, Farhang Shadman, Patrick Levy, Saied Tousi, Barry Gotlinsk, W. Scott Rader, Paul Lefevre, Isamu Koshiyama

Research output: Contribution to journal › Review article › peer-review

2 Scopus citations

Abstract

Characteristics of recycle fumed silica slurries in interlayer dielectric (ILD) chemical-mechanical polishing (CMP) applications were investigated. All polishing experiments were performed on 100-mm thermally grown SiO₂ wafers using a scaled version of a 472 polisher. Recycled slurry decreases the CMP removal rate and reduces the coefficient of friction, effects that are only partially alleviated by slurry filtering. The results show that filtration can reduce defects during CMP processing and is used as means of removing agglomerated particles or foreign materials that may have been introduced into the slurry as a result of ILD polishing.

Original language	English (US)
Pages (from-to)	71-82
Number of pages	12
Journal	MICRO
Volume	23
Issue number	6
State	Published - Jul 2005

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Materials Science(all)
Condensed Matter Physics
Electrical and Electronic Engineering

Cite this

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title = "Characterizing recycled fumed silica slurries in ILD CMP applications",

abstract = "Characteristics of recycle fumed silica slurries in interlayer dielectric (ILD) chemical-mechanical polishing (CMP) applications were investigated. All polishing experiments were performed on 100-mm thermally grown SiO2 wafers using a scaled version of a 472 polisher. Recycled slurry decreases the CMP removal rate and reduces the coefficient of friction, effects that are only partially alleviated by slurry filtering. The results show that filtration can reduce defects during CMP processing and is used as means of removing agglomerated particles or foreign materials that may have been introduced into the slurry as a result of ILD polishing.",

author = "Ara Philipossian and Farhang Shadman and Patrick Levy and Saied Tousi and Barry Gotlinsk and Rader, {W. Scott} and Paul Lefevre and Isamu Koshiyama",

year = "2005",

month = jul,

language = "English (US)",

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pages = "71--82",

journal = "MICRO",

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T1 - Characterizing recycled fumed silica slurries in ILD CMP applications

AU - Philipossian, Ara

AU - Shadman, Farhang

AU - Levy, Patrick

AU - Tousi, Saied

AU - Gotlinsk, Barry

AU - Rader, W. Scott

AU - Lefevre, Paul

AU - Koshiyama, Isamu

PY - 2005/7

Y1 - 2005/7

N2 - Characteristics of recycle fumed silica slurries in interlayer dielectric (ILD) chemical-mechanical polishing (CMP) applications were investigated. All polishing experiments were performed on 100-mm thermally grown SiO2 wafers using a scaled version of a 472 polisher. Recycled slurry decreases the CMP removal rate and reduces the coefficient of friction, effects that are only partially alleviated by slurry filtering. The results show that filtration can reduce defects during CMP processing and is used as means of removing agglomerated particles or foreign materials that may have been introduced into the slurry as a result of ILD polishing.

AB - Characteristics of recycle fumed silica slurries in interlayer dielectric (ILD) chemical-mechanical polishing (CMP) applications were investigated. All polishing experiments were performed on 100-mm thermally grown SiO2 wafers using a scaled version of a 472 polisher. Recycled slurry decreases the CMP removal rate and reduces the coefficient of friction, effects that are only partially alleviated by slurry filtering. The results show that filtration can reduce defects during CMP processing and is used as means of removing agglomerated particles or foreign materials that may have been introduced into the slurry as a result of ILD polishing.

UR - http://www.scopus.com/inward/record.url?scp=23044455887&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=23044455887&partnerID=8YFLogxK

M3 - Review article

AN - SCOPUS:23044455887

SN - 1081-0595

VL - 23

SP - 71

EP - 82

JO - MICRO

JF - MICRO

IS - 6

ER -

Characterizing recycled fumed silica slurries in ILD CMP applications

Abstract

ASJC Scopus subject areas

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