Characterizing diamond disc substrate loss and diamond micro-wear in copper CMP

X. Wei; J. Cheng; A. Meled; Y. Zhuang; L. Borucki; M. Moinpour; D. Hooper; A. Philipossian

Characterizing diamond disc substrate loss and diamond micro-wear in copper CMP

X. Wei, J. Cheng, A. Meled, Y. Zhuang, L. Borucki, M. Moinpour, D. Hooper, A. Philipossian

Research output: Contribution to conference › Paper › peer-review

Original language	English (US)
Pages	322-327
Number of pages	6
State	Published - 2008
Externally published	Yes
Event	13th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2008 - Fremont, CA, United States Duration: Mar 4 2008 → Mar 6 2008

Other

Other	13th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2008
Country/Territory	United States
City	Fremont, CA
Period	3/4/08 → 3/6/08

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering

Cite this

Wei, X, Cheng, J, Meled, A, Zhuang, Y, Borucki, L, Moinpour, M, Hooper, D & Philipossian, A 2008, 'Characterizing diamond disc substrate loss and diamond micro-wear in copper CMP', Paper presented at 13th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2008, Fremont, CA, United States, 3/4/08 - 3/6/08 pp. 322-327.

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title = "Characterizing diamond disc substrate loss and diamond micro-wear in copper CMP",

author = "X. Wei and J. Cheng and A. Meled and Y. Zhuang and L. Borucki and M. Moinpour and D. Hooper and A. Philipossian",

year = "2008",

language = "English (US)",

pages = "322--327",

note = "13th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2008 ; Conference date: 04-03-2008 Through 06-03-2008",

}

TY - CONF

T1 - Characterizing diamond disc substrate loss and diamond micro-wear in copper CMP

AU - Wei, X.

AU - Cheng, J.

AU - Meled, A.

AU - Zhuang, Y.

AU - Borucki, L.

AU - Moinpour, M.

AU - Hooper, D.

AU - Philipossian, A.

PY - 2008

Y1 - 2008

UR - https://www.scopus.com/pages/publications/84888233358

UR - https://www.scopus.com/inward/citedby.url?scp=84888233358&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:84888233358

SP - 322

EP - 327

T2 - 13th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2008

Y2 - 4 March 2008 through 6 March 2008

ER -

Characterizing diamond disc substrate loss and diamond micro-wear in copper CMP

Other

ASJC Scopus subject areas

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Cite this