Characterization of slurry residues in pad grooves for diamond disc and high pressure micro jet pad conditioning processes

Hyosang Lee; Yoshiyuki Seike; Zhonglin Li; Yun Zhuang; Mineo Takaoka; Keiji Miyachi; Ara Philipossian

doi:10.1143/JJAP.45.L1325

Characterization of slurry residues in pad grooves for diamond disc and high pressure micro jet pad conditioning processes

Hyosang Lee
, Yoshiyuki Seike
, Zhonglin Li
, Yun Zhuang
, Mineo Takaoka
, Keiji Miyachi
, Ara Philipossian

Chemical and Environmental Engineering

Research output: Contribution to journal › Article › peer-review

4 Scopus citations

Abstract

Slurry residues inside pad grooves are quantified by UV-enhanced fluorescence (UVEF) technique for conventional diamond disc and high pressure micro jet (HPMJ) pad conditioning methods. Results show that with HPMJ pad conditioning, slurry residues inside pad grooves decrease with time at twice the rate compared to diamond disc conditioning. Therefore, this suggests that HPMJ pad conditioning is a viable method to extend pad life and possibly improve wafer-level defectivity.

Original language	English (US)
Pages (from-to)	L1325-L1327
Journal	Japanese Journal of Applied Physics, Part 2: Letters
Volume	45
Issue number	46-50
DOIs	https://doi.org/10.1143/JJAP.45.L1325
State	Published - Dec 2006

Keywords

Chemical mechanical planarization (CMP)
High pressure micro jet (HPMJ) pad conditioning
Slurry residues
UV-enhanced fluorescence (UVEF) technique

ASJC Scopus subject areas

General Engineering
General Physics and Astronomy

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10.1143/JJAP.45.L1325

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title = "Characterization of slurry residues in pad grooves for diamond disc and high pressure micro jet pad conditioning processes",

abstract = "Slurry residues inside pad grooves are quantified by UV-enhanced fluorescence (UVEF) technique for conventional diamond disc and high pressure micro jet (HPMJ) pad conditioning methods. Results show that with HPMJ pad conditioning, slurry residues inside pad grooves decrease with time at twice the rate compared to diamond disc conditioning. Therefore, this suggests that HPMJ pad conditioning is a viable method to extend pad life and possibly improve wafer-level defectivity.",

keywords = "Chemical mechanical planarization (CMP), High pressure micro jet (HPMJ) pad conditioning, Slurry residues, UV-enhanced fluorescence (UVEF) technique",

author = "Hyosang Lee and Yoshiyuki Seike and Zhonglin Li and Yun Zhuang and Mineo Takaoka and Keiji Miyachi and Ara Philipossian",

year = "2006",

month = dec,

doi = "10.1143/JJAP.45.L1325",

language = "English (US)",

volume = "45",

pages = "L1325--L1327",

journal = "Japanese Journal of Applied Physics, Part 2: Letters",

issn = "0021-4922",

publisher = "Institute of Physics",

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}

TY - JOUR

T1 - Characterization of slurry residues in pad grooves for diamond disc and high pressure micro jet pad conditioning processes

AU - Lee, Hyosang

AU - Seike, Yoshiyuki

AU - Li, Zhonglin

AU - Zhuang, Yun

AU - Takaoka, Mineo

AU - Miyachi, Keiji

AU - Philipossian, Ara

PY - 2006/12

Y1 - 2006/12

N2 - Slurry residues inside pad grooves are quantified by UV-enhanced fluorescence (UVEF) technique for conventional diamond disc and high pressure micro jet (HPMJ) pad conditioning methods. Results show that with HPMJ pad conditioning, slurry residues inside pad grooves decrease with time at twice the rate compared to diamond disc conditioning. Therefore, this suggests that HPMJ pad conditioning is a viable method to extend pad life and possibly improve wafer-level defectivity.

AB - Slurry residues inside pad grooves are quantified by UV-enhanced fluorescence (UVEF) technique for conventional diamond disc and high pressure micro jet (HPMJ) pad conditioning methods. Results show that with HPMJ pad conditioning, slurry residues inside pad grooves decrease with time at twice the rate compared to diamond disc conditioning. Therefore, this suggests that HPMJ pad conditioning is a viable method to extend pad life and possibly improve wafer-level defectivity.

KW - Chemical mechanical planarization (CMP)

KW - High pressure micro jet (HPMJ) pad conditioning

KW - Slurry residues

KW - UV-enhanced fluorescence (UVEF) technique

UR - https://www.scopus.com/pages/publications/33847761949

UR - https://www.scopus.com/pages/publications/33847761949#tab=citedBy

U2 - 10.1143/JJAP.45.L1325

DO - 10.1143/JJAP.45.L1325

M3 - Article

AN - SCOPUS:33847761949

SN - 0021-4922

VL - 45

SP - L1325-L1327

JO - Japanese Journal of Applied Physics, Part 2: Letters

JF - Japanese Journal of Applied Physics, Part 2: Letters

IS - 46-50

ER -

Characterization of slurry residues in pad grooves for diamond disc and high pressure micro jet pad conditioning processes

Abstract

Keywords

ASJC Scopus subject areas

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