Characterization of microstrip interconnects over gridded ground planes

Zhu Lin; Kathleen L. Melde

doi:10.1109/EPEP.2005.1563705

Characterization of microstrip interconnects over gridded ground planes

Zhu Lin, Kathleen L. Melde

Electrical and Computer Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Scopus citations

Abstract

An equivalent circuit and modeling approach for microstrip packaging interconnects over a gridded ground plane are proposed. The equivalent characteristic imnpedance and propagation constant of the line are derived. The modeling approach is verified by frequency/time domain measurements.

Original language	English (US)
Title of host publication	14th Topical Meeting on Electrical Performance of Electronic Packaging 2005
Pages	75-78
Number of pages	4
DOIs	https://doi.org/10.1109/EPEP.2005.1563705
State	Published - 2005
Event	14th Topical Meeting on Electrical Performance of Electronic Packaging 2005 - Austin, TX, United States Duration: Oct 24 2005 → Oct 26 2005

Publication series

Name	IEEE Topical Meeting on Electrical Performance of Electronic Packaging
Volume	2005

Other

Other	14th Topical Meeting on Electrical Performance of Electronic Packaging 2005
Country/Territory	United States
City	Austin, TX
Period	10/24/05 → 10/26/05

ASJC Scopus subject areas

General Engineering

Access to Document

10.1109/EPEP.2005.1563705

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Characterization of microstrip interconnects over gridded ground planes. / Lin, Zhu; Melde, Kathleen L.
14th Topical Meeting on Electrical Performance of Electronic Packaging 2005. 2005. p. 75-78 1563705 (IEEE Topical Meeting on Electrical Performance of Electronic Packaging; Vol. 2005).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Lin, Z & Melde, KL 2005, Characterization of microstrip interconnects over gridded ground planes. in 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005., 1563705, IEEE Topical Meeting on Electrical Performance of Electronic Packaging, vol. 2005, pp. 75-78, 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005, Austin, TX, United States, 10/24/05. https://doi.org/10.1109/EPEP.2005.1563705

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abstract = "An equivalent circuit and modeling approach for microstrip packaging interconnects over a gridded ground plane are proposed. The equivalent characteristic imnpedance and propagation constant of the line are derived. The modeling approach is verified by frequency/time domain measurements.",

author = "Zhu Lin and Melde, {Kathleen L.}",

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Characterization of microstrip interconnects over gridded ground planes

Abstract

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Other

ASJC Scopus subject areas

Access to Document

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