CFD analysis of the heat dissipation of plates with novel flow fields for the cooling of electronic devices

Keyphrases

• Aluminium Structures 33%
• CFD Analysis 100%
• Constant Property 33%
• Convective Heat Transfer Coefficient 33%
• Dissipation Process 33%
• Efficient Heat Dissipation 33%
• Electronics Cooling 100%
• Flow Distribution Uniformity 33%
• Flow Equation 33%
• Liquid Cooling 33%
• Low Pressure Drop 33%
• Moderate Heat 33%
• Novel Flow Fields 100%
• Solid Aluminum 33%

Chemical Engineering

• Heat Flux 100%
• Heat Transfer Coefficient 50%

Engineering

• Aluminum Structure 25%
• Convection Heat Transfer Coefficient 25%
• Flow Equation 25%
• Liquid Cooling 25%