CFD analysis of the heat dissipation of plates with novel flow fields for the cooling of electronic devices

The continuous advances in electronic devices require new and efficient heat dissipation techniques to achieve an acceptable performance of these equipments. Conventional airflow heat sinks are not sufficient when high heat fluxes are present. Therefore, using liquid cooling becomes a suitable alternative due to the high convection heat transfer coefficients that can be achieved by these means. This work presents the numerical study of a non-conventional flow pattern employed for the heat dissipation of plates with moderate heat fluxes. The numerical model consist of the flow channels and a solid aluminum structure. The energy and flow equations are solved including a model of non{reversed not sign}constant properties. These new flow fields present very low pressure drops as well as an excellent uniformity of flow distribution, such aspects, make plausible to increase the operating flow rates and therefore, to improve the performance of the heat dissipation process.