CFD analysis of flow and heat transfer in a novel heat sink for electronic devices

Bladimir Ramos-Alvarado; Peiwen Li; Hong Liu; Abel Hernandez-Guerrero

doi:10.1115/IMECE2010-39935

CFD analysis of flow and heat transfer in a novel heat sink for electronic devices

Bladimir Ramos-Alvarado, Peiwen Li, Hong Liu, Abel Hernandez-Guerrero

Aerospace and Mechanical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Scopus citations

Abstract

Novel flow channel configurations in heat sinks for electronics cooling were proposed in this paper. Computational analyses were carried out to better understand the heat transfer performance, the uniformity of temperature fields of the heat sinking surface, as well as the pressure losses and pumping power in the operation of heat sinks. Comparison of the overall performance regarding to temperature uniformity on the heat sink surface and pumping power consumption was made for heat sinks having novel flow channel configurations and having traditional flow channel configurations. It has been found that the novel flow channel configuration dramatically reduces the pressure loss in the flow field. Giving the same pumping power consumption of an electronics cooling process, the temperature difference on surface of the heat sink which has novel flow channel configuration can be much lower than that of the heat sinks which have traditional flow channel configurations.

Original language	English (US)
Title of host publication	Fluid Flow, Heat Transfer and Thermal Systems
Publisher	American Society of Mechanical Engineers (ASME)
Pages	1589-1596
Number of pages	8
Edition	PARTS A AND B
ISBN (Print)	9780791844441
DOIs	https://doi.org/10.1115/IMECE2010-39935
State	Published - 2010
Event	ASME 2010 International Mechanical Engineering Congress and Exposition, IMECE 2010 - Vancouver, BC, Canada Duration: Nov 12 2010 → Nov 18 2010

Publication series

Name	ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
Number	PARTS A AND B
Volume	7

Conference

Conference	ASME 2010 International Mechanical Engineering Congress and Exposition, IMECE 2010
Country/Territory	Canada
City	Vancouver, BC
Period	11/12/10 → 11/18/10

ASJC Scopus subject areas

Mechanical Engineering

Access to Document

10.1115/IMECE2010-39935

Cite this

Ramos-Alvarado, B., Li, P., Liu, H., & Hernandez-Guerrero, A. (2010). CFD analysis of flow and heat transfer in a novel heat sink for electronic devices. In Fluid Flow, Heat Transfer and Thermal Systems (PARTS A AND B ed., pp. 1589-1596). (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE); Vol. 7, No. PARTS A AND B). American Society of Mechanical Engineers (ASME). https://doi.org/10.1115/IMECE2010-39935

CFD analysis of flow and heat transfer in a novel heat sink for electronic devices. / Ramos-Alvarado, Bladimir; Li, Peiwen; Liu, Hong et al.
Fluid Flow, Heat Transfer and Thermal Systems. PARTS A AND B. ed. American Society of Mechanical Engineers (ASME), 2010. p. 1589-1596 (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE); Vol. 7, No. PARTS A AND B).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Ramos-Alvarado, B, Li, P, Liu, H & Hernandez-Guerrero, A 2010, CFD analysis of flow and heat transfer in a novel heat sink for electronic devices. in Fluid Flow, Heat Transfer and Thermal Systems. PARTS A AND B edn, ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE), no. PARTS A AND B, vol. 7, American Society of Mechanical Engineers (ASME), pp. 1589-1596, ASME 2010 International Mechanical Engineering Congress and Exposition, IMECE 2010, Vancouver, BC, Canada, 11/12/10. https://doi.org/10.1115/IMECE2010-39935

Ramos-Alvarado B, Li P, Liu H, Hernandez-Guerrero A. CFD analysis of flow and heat transfer in a novel heat sink for electronic devices. In Fluid Flow, Heat Transfer and Thermal Systems. PARTS A AND B ed. American Society of Mechanical Engineers (ASME). 2010. p. 1589-1596. (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE); PARTS A AND B). doi: 10.1115/IMECE2010-39935

Ramos-Alvarado, Bladimir ; Li, Peiwen ; Liu, Hong et al. / CFD analysis of flow and heat transfer in a novel heat sink for electronic devices. Fluid Flow, Heat Transfer and Thermal Systems. PARTS A AND B. ed. American Society of Mechanical Engineers (ASME), 2010. pp. 1589-1596 (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE); PARTS A AND B).

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CFD analysis of flow and heat transfer in a novel heat sink for electronic devices

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