Causal analysis of conditioner design factors on removal rates in copper CMP

L. Borucki; N. Rikita; Y. Zhuang; H. Lee; R. Zhuang; T. Yamashita; R. Kikuma; A. Philipossian

Causal analysis of conditioner design factors on removal rates in copper CMP

L. Borucki, N. Rikita, Y. Zhuang, H. Lee, R. Zhuang, T. Yamashita, R. Kikuma, A. Philipossian

Research output: Contribution to conference › Paper › peer-review

Abstract

A theory of conditioning, friction, and material removal is outlined that connects pad surface topography from conditioning with removal rates. The theory predicts a priori that friction and removal rate should both decrease as the conditioned surface becomes less abrupt. Simple models of cut rate and active diamond count also further indicate that abruptness should decrease with increasing conditioner load. Three Mitsubishi Materials Corporation conditioners with different grit sizes are used to test the theory in an experiment in which the conditioner load is varied from light to heavy. Polishing experiments and pad profilometry verify the main predictions of the theory.

Original language	English (US)
Pages	272-279
Number of pages	8
State	Published - 2006
Externally published	Yes
Event	11th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2006 - Fremont, CA, United States Duration: Feb 21 2006 → Feb 23 2006

Other

Other	11th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2006
Country/Territory	United States
City	Fremont, CA
Period	2/21/06 → 2/23/06

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering

Cite this

Borucki, L, Rikita, N, Zhuang, Y, Lee, H, Zhuang, R, Yamashita, T, Kikuma, R & Philipossian, A 2006, 'Causal analysis of conditioner design factors on removal rates in copper CMP', Paper presented at 11th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2006, Fremont, CA, United States, 2/21/06 - 2/23/06 pp. 272-279.

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abstract = "A theory of conditioning, friction, and material removal is outlined that connects pad surface topography from conditioning with removal rates. The theory predicts a priori that friction and removal rate should both decrease as the conditioned surface becomes less abrupt. Simple models of cut rate and active diamond count also further indicate that abruptness should decrease with increasing conditioner load. Three Mitsubishi Materials Corporation conditioners with different grit sizes are used to test the theory in an experiment in which the conditioner load is varied from light to heavy. Polishing experiments and pad profilometry verify the main predictions of the theory.",

author = "L. Borucki and N. Rikita and Y. Zhuang and H. Lee and R. Zhuang and T. Yamashita and R. Kikuma and A. Philipossian",

year = "2006",

language = "English (US)",

pages = "272--279",

note = "11th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2006 ; Conference date: 21-02-2006 Through 23-02-2006",

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TY - CONF

T1 - Causal analysis of conditioner design factors on removal rates in copper CMP

AU - Borucki, L.

AU - Rikita, N.

AU - Zhuang, Y.

AU - Lee, H.

AU - Zhuang, R.

AU - Yamashita, T.

AU - Kikuma, R.

AU - Philipossian, A.

PY - 2006

Y1 - 2006

N2 - A theory of conditioning, friction, and material removal is outlined that connects pad surface topography from conditioning with removal rates. The theory predicts a priori that friction and removal rate should both decrease as the conditioned surface becomes less abrupt. Simple models of cut rate and active diamond count also further indicate that abruptness should decrease with increasing conditioner load. Three Mitsubishi Materials Corporation conditioners with different grit sizes are used to test the theory in an experiment in which the conditioner load is varied from light to heavy. Polishing experiments and pad profilometry verify the main predictions of the theory.

AB - A theory of conditioning, friction, and material removal is outlined that connects pad surface topography from conditioning with removal rates. The theory predicts a priori that friction and removal rate should both decrease as the conditioned surface becomes less abrupt. Simple models of cut rate and active diamond count also further indicate that abruptness should decrease with increasing conditioner load. Three Mitsubishi Materials Corporation conditioners with different grit sizes are used to test the theory in an experiment in which the conditioner load is varied from light to heavy. Polishing experiments and pad profilometry verify the main predictions of the theory.

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M3 - Paper

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T2 - 11th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2006

Y2 - 21 February 2006 through 23 February 2006

ER -

Causal analysis of conditioner design factors on removal rates in copper CMP

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