Abstract
To achieve a defect-free wafer surface, slurry residuals and other contaminants are required to be removed after a chemical mechanical planarization (CMP) process. Brush scrubbing, a process based on direct contact between a soft polyvinyl alcohol (PVA) brush and the wafer surface is widely accepted in post-CMP cleaning due to process flexibility, single-wafer processing configuration, and reduced cost of ownership. Researches have shown that the cleaning performance of the brush scrubbing process depends on the cleaning chemistry, tool kinematics, and properties of PVA brushes. This chapter reviews and summarizes current and past work on brush scrubbing and discusses the important aspects of cleaning mechanism, tool kinematics, and consumables.
Original language | English (US) |
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Title of host publication | Methods for Surface Cleaning |
Publisher | Elsevier Inc. |
Pages | 109-133 |
Number of pages | 25 |
Volume | 9 |
ISBN (Electronic) | 9780323431729 |
ISBN (Print) | 9780323431576 |
DOIs | |
State | Published - 2017 |
Keywords
- Brush scrubbing
- Cleaning chemistry
- PVA brush
- Post-CMP cleaning
- Tool kinematics
ASJC Scopus subject areas
- General Engineering
- General Materials Science